 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| 47 R Platform Flash In-System Programmable Configuration PROMs Product Specification DS123 (v2.13.1) April 3, 2008 0 Features * * * * * * * * * * In-System Programmable PROMs for Configuration of Xilinx(R) FPGAs Low-Power Advanced CMOS NOR Flash Process Endurance of 20,000 Program/Erase Cycles Operation over Full Industrial Temperature Range (-40C to +85C) IEEE Standard 1149.1/1532 Boundary-Scan (JTAG) Support for Programming, Prototyping, and Testing JTAG Command Initiation of Standard FPGA Configuration Cascadable for Storing Longer or Multiple Bitstreams Dedicated Boundary-Scan (JTAG) I/O Power Supply (VCCJ) I/O Pins Compatible with Voltage Levels Ranging From 1.5V to 3.3V Design Support Using the Xilinx Alliance ISE(R) and FoundationTM ISE Series Software Packages * XCF01S/XCF02S/XCF04S 3.3V Supply Voltage Serial FPGA Configuration Interface (up to 33 MHz) Available in Small-Footprint VO20 and VOG20 Packages 1.8V Supply Voltage Serial or Parallel FPGA Configuration Interface (up to 33 MHz) Available in Small-Footprint VO48, VOG48, FS48, and FSG48 Packages Design Revision Technology Enables Storing and Accessing Multiple Design Revisions for Configuration Built-In Data Decompressor Compatible with Xilinx Advanced Compression Technology * XCF08P/XCF16P/XCF32P Description Xilinx introduces the Platform Flash series of in-system programmable configuration PROMs. Available in 1 to 32 Megabit (Mbit) densities, these PROMs provide an easy-touse, cost-effective, and reprogrammable method for storing large Xilinx FPGA configuration bitstreams. The Platform Flash PROM series includes both the 3.3V XCFxxS PROM and the 1.8V XCFxxP PROM. The XCFxxS version includes 4-Mbit, 2-Mbit, and 1-Mbit PROMs that support Master Table 1: Platform Flash PROM Features Device Density VCCINT VCCO Range VCCJ Range Packages Program In-system via JTAG Serial Config. Parallel Config. Design Revisioning Compression Serial and Slave Serial FPGA configuration modes (Figure 1, page 2). The XCFxxP version includes 32-Mbit, 16-Mbit, and 8-Mbit PROMs that support Master Serial, Slave Serial, Master SelectMAP, and Slave SelectMAP FPGA configuration modes (Figure 2, page 2). A summary of the Platform Flash PROM family members and supported features is shown in Table 1. XCF01S XCF02S XCF04S XCF08P XCF16P XCF32P 1 Mbit 2 Mbit 4 Mbit 8 Mbit 16 Mbit 32 Mbit 3.3V 3.3V 3.3V 1.8V 1.8V 1.8V 1.8V - 3.3V 2.5V - 3.3V 1.8V - 3.3V 2.5V - 3.3V 1.8V - 3.3V 2.5V - 3.3V 1.5V - 3.3V 2.5V - 3.3V 1.5V - 3.3V 2.5V - 3.3V 1.5V - 3.3V 2.5V - 3.3V VO20/VOG20 VO20/VOG20 VO20/VOG20 VO48/VOG48 FS48/FSG48 VO48/VOG48 FS48/FSG48 VO48/VOG48 FS48/FSG48 (c) 2003-2008 Xilinx, Inc. All rights reserved. XILINX, the Xilinx logo, Virtex, Spartan, ISE and other designated brands included herein are trademarks of Xilinx in the United States and other countries. All other trademarks are the property of their respective owners. DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 1 R Platform Flash In-System Programmable Configuration PROMs X-Ref Target - Figure 1 CLK CE OE/RESET TCK TMS TDI TDO Control and JTAG Interface Data Memory Address Data Serial Interface CEO DATA (D0) Serial Mode CF ds123_01_30603 Figure 1: XCFxxS Platform Flash PROM Block Diagram X-Ref Target - Figure 2FI CLK CE EN_EXT_SEL OE/RESET BUSY OSC Decompressor TCK TMS TDI TDO CLKOUT Control and JTAG Interface Data Address Memory Data Serial or Parallel Interface CEO DATA (D0) (Serial/Parallel Mode) D[1:7] (Parallel Mode) CF REV_SEL [1:0] DS123_19_031908 Figure 2: XCFxxP Platform Flash PROM Block Diagram When the FPGA is in Master Serial mode, it generates a configuration clock that drives the PROM. With CF High, a short access time after CE and OE are enabled, data is available on the PROM DATA (D0) pin that is connected to the FPGA DIN pin. New data is available a short access time after each rising clock edge. The FPGA generates the appropriate number of clock pulses to complete the configuration. When the FPGA is in Slave Serial mode, the PROM and the FPGA are both clocked by an external clock source, or optionally, for the XCFxxP PROM only, the PROM can be used to drive the FPGA's configuration clock. The XCFxxP version of the Platform Flash PROM also supports Master SelectMAP and Slave SelectMAP (or Slave Parallel) FPGA configuration modes. When the FPGA is in Master SelectMAP mode, the FPGA generates a configuration clock that drives the PROM. When the FPGA is in Slave SelectMAP Mode, either an external oscillator generates the configuration clock that drives the PROM and the FPGA, or optionally, the XCFxxP PROM can be used to drive the FPGA's configuration clock. With BUSY Low and CF High, after CE and OE are enabled, data is available on the PROMs DATA (D0-D7) pins. New data is available a short access time after each rising clock edge. The data is clocked into the FPGA on the following rising edge of the CCLK. A free-running oscillator can be used in the Slave Parallel/Slave SelecMAP mode. The XCFxxP version of the Platform Flash PROM provides additional advanced features. A built-in data decompressor supports utilizing compressed PROM files, and design revisioning allows multiple design revisions to be stored on a single PROM or stored across several PROMs. For design revisioning, external pins or internal control bits are used to select the active design revision. Multiple Platform Flash PROM devices can be cascaded to support the larger configuration files required when targeting larger FPGA devices or targeting multiple FPGAs daisy chained together. When utilizing the advanced features for the XCFxxP Platform Flash PROM, such as design revisioning, programming files which span cascaded PROM devices can only be created for cascaded chains containing only XCFxxP PROMs. If the advanced XCFxxP features are not enabled, then the cascaded chain can include both XCFxxP and XCFxxS PROMs. The Platform Flash PROMs are compatible with all of the existing FPGA device families. A reference list of Xilinx FPGAs and the respective compatible Platform Flash PROMs is given in Table 2, page 3. A list of Platform Flash PROMs and their capacities is given in Table 3, page 4. DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 2 R Platform Flash In-System Programmable Configuration PROMs Table 2: Xilinx FPGAs and Compatible Platform Flash PROMs (Cont'd) FPGA XC4VFX40 8,374,016 12,556,672 21,845,632 29,124,608 41,048,064 53,139,456 XCF08P XCF16P XCF32P XCF32P XCF32P+XCF08P XCF32P+XCF32P XC4VFX60 XC4VFX100 XC4VFX140 Virtex-4 SX FPGAs XC4VSX25 XC4VSX35 XC4VSX55 9,147,648 13,700,288 22,749,184 XCF16P XCF16P XCF32P Table 2: Xilinx FPGAs and Compatible Platform Flash PROMs FPGA Configuration Bitstream Platform Flash PROM (1) Configuration Bitstream 14,936,192 21,002,880 33,065,408 47,856,896 Platform Flash PROM (1) XCF16P XCF32P XCF32P XCF32P+XCF16P Virtex(R)-5 LX FPGAs XC5VLX30 XC5VLX50 XC5VLX85 XC5VLX110 XC5VLX155 XC5VLX220 XC5VLX330 79,704,832 XCF32P+XCF32P+XCF16P Virtex-5 LXT FPGAs XC5VLX20T XC5VLX30T XC5VLX50T XC5VLX85T XC5VLX110T XC5VLX155T XC5VLX220T XC5VLX330T 6,251,200 9,371,136 14,052,352 23,341,312 31,118,848 43,042,304 55,133,696 XCF08P XCF16P XCF16P XCF32P XCF32P XCF32P+XCF16P XCF32P+XCF32P Virtex-II Pro X FPGAs XC2VPX20 XC2VPX70 Virtex-II Pro FPGAs XC2VP2 XC2VP4 XC2VP7 XC2VP20 XC2VP30 XC2VP40 XCF16P XCF32P XCF32P+XCF08P XC2VP50 XC2VP70 XC2VP100 Virtex-II FPGAs(3) XCF16P XCF32P XCF32P+XCF08P XCF32P+XCF16P XC2V40 XC2V80 XC2V250 XC2V500 XC2V1000 XC2V1500 4,765,568 7,819,904 XCF08P XCF08P XCF16P XCF32P XCF32P XCF32P XCF32P+XCF08P XCF32P+XCF32P XC2V2000 XC2V3000 XC2V4000 XC2V6000 XC2V8000 Virtex-E FPGAs XCV50E XCV100E XCV200E 4,765,568 7,242,624 XCF08P XCF08P XCV300E XCV400E 630,048 863,840 1,442,016 1,875,648 2,693,440 XCF01S XCF01S XCF02S XCF02S XCF04S 470,048 732,576 1,726,880 2,767,520 4,089,504 5,667,488 7,501,472 10,505,120 15,673,248 21,865,376 29,081,504 XCF01S XCF01S XCF02S XCF04S XCF04S XCF08P XCF08P XCF16P XCF16P XCF32P XCF32P 1,305,376 3,006,496 4,485,408 8,214,560 11,589,920 15,868,192 19,021,344 26,098,976 34,292,768 XCF02S XCF04S XCF08P XCF08P XCF16P XCF16P XCF32P XCF32P XCF32P (2) 8,214,560 26,098,976 XCF08P XCF32P 82,696,192 XCF32P+XCF32P+XCF16P Virtex-5 SXT FPGAs XC5VSX35T XC5VSX50T XC5VSX95T 13,349,120 20,019,328 35,716,096 Virtex-5 FXT FPGAs XC5VFX30T XC5VFX70T XC5VFX100T XC5VFX130T XC5VFX200T Virtex-4 LX FPGAs XC4VLX15 XC4VLX25 XC4VLX40 XC4VLX60 XC4VLX80 XC4VLX100 XC4VLX160 XC4VLX200 Virtex-4 FX FPGAs XC4VFX12 XC4VFX20 13,517,056 27,025,408 39,389,696 49,234,944 70,856,704 XCF32P+XCF32P+XCF08P 12,259,712 17,717,632 23,291,008 30,711,680 40,347,008 51,367,808 DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 3 R Platform Flash In-System Programmable Configuration PROMs Table 2: Xilinx FPGAs and Compatible Platform Flash PROMs (Cont'd) FPGA XC3S400 XC3S1000 XC3S1500 XC3S2000 XC3S4000 XC3S5000 Spartan-IIE FPGAs XC2S50E XC2S100E 559,200 781,216 1,040,096 1,335,840 1,751,808 2,546,048 3,607,968 4,715,616 6,127,744 XCF01S XCF01S XCF01S XCF02S XCF02S XCF04S XCF04S XCF08P XCF08P XC2S150E XC2S200E XC2S300E XC2S400E XC2S600E Spartan-II FPGAs XC2S15 XC2S30 XC2S50 XC2S100 437,312 1,196,128 1,886,560 2,732,640 4,755,296 XCF01S XCF02S XCF02S XCF04S XCF08P 2. Table 2: Xilinx FPGAs and Compatible Platform Flash PROMs (Cont'd) FPGA XCV405E XCV600E XCV812E XCV1000E XCV1600E XCV2000E XCV2600E XCV3200E Virtex FPGAs XCV50 XCV100 XCV150 XCV200 XCV300 XCV400 XCV600 XCV800 XCV1000 Spartan(R)-3A XC3S50A XC3S200A XC3S400A XC3S700A XC3S1400A Configuration Bitstream 3,430,400 3,961,632 6,519,648 6,587,520 8,308,992 10,159,648 12,922,336 16,283,712 Platform Flash PROM (1) XCF04S XCF04S XCF08P XCF08P XCF08P XCF16P XCF16P XCF16P Configuration Bitstream 1,699,136 3,223,488 5,214,784 7,673,024 11,316,864 13,271,936 Platform Flash PROM (1) XCF02S XCF04S XCF08P XCF08P XCF16P XCF16P 630,048 863,840 1,134,496 1,442,016 1,875,648 2,693,440 3,961,632 XCF01S XCF01S XCF02S XCF02S XCF02S XCF04S XCF04S 197,696 336,768 559,200 781,216 1,040,096 1,335,840 XCF01S XCF01S XCF01S XCF01S XCF01S XCF02S FPGAs XC2S150 XC2S200 Notes: 1. Spartan-3A DSP FPGAs XC3SD1800A XC3SD3400A Spartan-3E FPGAs XC3S100E XC3S250E XC3S500E XC3S1200E XC3S1600E Spartan-3 FPGAs XC3S50 XC3S200 439,264 1,047,616 XCF01S XCF01S 581,344 1,353,728 2,270,208 3,841,184 5,969,696 XCF01S XCF02S XCF04S XCF04S XCF08P 8,197,280 11,718,304 XCF08P XCF16P 3. If design revisioning or other advanced feature support is required, the XCFxxP can be used as an alternative to the XCF01S, XCF02S, or XCF04S. Assumes the Platform Flash XCFxxP PROM advanced compression feature or BitGen -compress option is used and the compression method successfully fits the bitstream within the suggested PROM. The largest non-debug bitstream size is specified for each FPGA. Refer to the appropriate FPGA user guides for information on CONFIG STEPPING constraints or BitGen options (such as -g FreezeDCI:Yes) that affect bitstream size. Table 3: Platform Flash PROM Capacity Platform Flash PROM XCF01S XCF02S XCF04S Configuration Bits Platform Flash PROM Configuration Bits 8,388,608 16,777,216 33,554,432 1,048,576 XCF08P 2,097,152 XCF16P 4,194,304 XCF32P DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 4 R Platform Flash In-System Programmable Configuration PROMs Programming The Platform Flash PROM is a reprogrammable NOR flash device (refer "Quality and Reliability Characteristics," page 27 for the program/erase specifications). Reprogramming requires an erase followed by a program operation. A verify operation is recommended after the program operation to validate the correct transfer of data from the programmer source to the Platform Flash PROM. Several programming solutions are available. Embedded, in-system programming reference designs, such as XAPP058, Xilinx In-System Programming Using an Embedded Microcontroller, are available on the Xilinx web page for PROM Programming and Data Storage Application Notes. See the UG161, Platform Flash PROM User Guide, for an advanced update methodology that uses the Design Revisioning feature in the Platform Flash XCFxxP PROMs. OE/RESET The 1/2/4 Mbit XCFxxS Platform Flash PROMs in-system programming algorithm results in issuance of an internal device reset that causes OE/RESET to pulse Low. In-System Programming In-System Programmable PROMs can be programmed individually, or two or more can be daisy-chained together and programmed in-system via the standard 4-pin JTAG protocol as shown in Figure 3. In-system programming offers quick and efficient design iterations and eliminates unnecessary package handling or socketing of devices. The programming data sequence is delivered to the device using either Xilinx iMPACT software and a Xilinx download cable, a third-party JTAG development system, a JTAG-compatible board tester, or a simple microprocessor interface that emulates the JTAG instruction sequence. The iMPACT software also outputs serial vector format (SVF) files for use with any tools that accept SVF format, including automatic test equipment. During in-system programming, the CEO output is driven High. All other outputs are held in a high-impedance state or held at clamp levels during in-system programming. Insystem programming is fully supported across the recommended operating voltage and temperature ranges. X-Ref Target - Figure 3 External Programming In traditional manufacturing environments, third-party device programmers can program Platform Flash PROMs with an initial memory image before the PROMs are assembled onto boards. Contact a preferred third-party programmer vendor for Platform Flash PROM support information. A sample list of third-party programmer vendors with Platform Flash PROM support is available on the Xilinx web page for Third-Party Programmer Device Support. Pre-programmed PROMs can be assembled onto boards using the typical soldering process guidelines in the UG112, Device Package User Guide. A pre-programmed PROM's memory image can be updated after board assembly using an in-system programming solution. Reliability and Endurance Xilinx in-system programmable products provide a guaranteed endurance level of 20,000 in-system program/ erase cycles and a minimum data retention of 20 years. Each device meets all functional, performance, and data retention specifications within this endurance limit. See the UG116, Xilinx Device Reliability Report, for device quality, reliability, and process node information. V CC GND (a) (b) DS123_33_031908 Figure 3: JTAG In-System Programming Operation (a) Solder Device to PCB (b) Program Using Download Cable DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 5 R Platform Flash In-System Programmable Configuration PROMs Design Security The Xilinx in-system programmable Platform Flash PROM devices incorporate advanced data security features to fully protect the FPGA programming data against unauthorized reading via JTAG. The XCFxxP PROMs can also be programmed to prevent inadvertent writing via JTAG. Table 4 and Table 5 show the security settings available for the XCFxxS PROM and XCFxxP PROM, respectively. Write Protection The XCFxxP PROM device also allows the user to write protect (or lock) a particular design revision to prevent inadvertent erase or program operations. Once set, the write protect security bit for an individual design revision must be reset (using the UNLOCK command followed by ISC_ERASE command) before an erase or program operation can be performed. Table 4: XCFxxS Device Data Security Options Read Protect Reset (default) Set Read Protection The read protect security bit can be set by the user to prevent the internal programming pattern from being read or copied via JTAG. Read protection does not prevent write operations. For the XCFxxS PROM, the read protect security bit is set for the entire device, and resetting the read protect security bit requires erasing the entire device. For the XCFxxP PROM the read protect security bit can be set for individual design revisions, and resetting the read protect bit requires erasing the particular design revision. Table 5: XCFxxP Design Revision Data Security Options Read Protect Reset (default) Reset (default) Set Set Read/Verify Inhibited Program Inhibited Erase Inhibited Write Protect Reset (default) Set Reset (default) Set Read/Verify Inhibited Program Inhibited Erase Inhibited DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 6 R Platform Flash In-System Programmable Configuration PROMs IEEE 1149.1 Boundary-Scan (JTAG) The Platform Flash PROM family is compatible with the IEEE 1149.1 Boundary-Scan standard and the IEEE 1532 insystem configuration standard. A Test Access Port (TAP) and registers are provided to support all required Boundary-Scan instructions, as well as many of the optional instructions specified by IEEE Std. 1149.1. In addition, the JTAG interface is used to implement in-system programming (ISP) to facilitate configuration, erasure, and verification operations on the Platform Flash PROM device. Table 6 lists the required and optional Boundary-Scan instructions supported in the Platform Flash PROMs. Refer to the IEEE Std. 1149.1 specification for a complete description of Boundary-Scan architecture and the required and optional instructions. Caution! The XCFxxP JTAG TAP pause states are not fully compliant with the JTAG 1149.1 specification. If a temporary pause of a JTAG shift operation is required, then stop the JTAG TCK clock and maintain the JTAG TAP within the JTAG Shift-IR or Shift-DR TAP state. Do not transition the XCFxxP JTAG TAP through the JTAG Pause-IR or Pause-DR TAP state to temporarily pause a JTAG shift operation. Table 6: Platform Flash PROM Boundary-Scan Instructions Boundary-Scan Command Required Instructions BYPASS SAMPLE/PRELOAD EXTEST Optional Instructions CLAMP HIGHZ IDCODE USERCODE FA FC FE FD 00FA 00FC 00FE 00FD Enables Boundary-Scan CLAMP operation Places all outputs in high-impedance state simultaneously Enables shifting out 32-bit IDCODE Enables shifting out 32-bit USERCODE Initiates FPGA configuration by pulsing CF pin Low once. (For the XCFxxP this command also resets the selected design revision based on either the external REV_SEL[1:0] pins or on the internal design revision selection bits.) (1) FF 01 00 FFFF 0001 0000 Enables BYPASS Enables Boundary-Scan SAMPLE/PRELOAD operation Enables Boundary-Scan EXTEST operation XCFxxS IR[7:0] (hex) XCFxxP IR[15:0] (hex) Instruction Description Platform Flash PROM Specific Instructions CONFIG EE 00EE Notes: 1. For more information see "Initiating FPGA Configuration," page 15. Instruction Register The Instruction Register (IR) for the Platform Flash PROM is connected between TDI and TDO during an instruction scan sequence. In preparation for an instruction scan sequence, the instruction register is parallel loaded with a fixed instruction capture pattern. This pattern is shifted out onto TDO (LSB first), while an instruction is shifted into the instruction register from TDI. XCFxxP Instruction Register (16 bits wide) The Instruction Register (IR) for the XCFxxP PROM is sixteen bits wide and is connected between TDI and TDO during an instruction scan sequence. The detailed composition of the instruction capture pattern is illustrated in Table 8, page 8. The instruction capture pattern shifted out of the XCFxxP device includes IR[15:0]. IR[15:9] are reserved bits and are set to a logic 0. The ISC Error field, IR[8:7], contains a 10 when an ISC operation is a success; otherwise a 01 when an In-System Configuration (ISC) operation fails. The Erase/Program (ER/PROG) Error field, IR[6:5], contains a 10 when an erase or program operation is a success; otherwise a 01 when an erase or program operation fails. The Erase/Program (ER/PROG) Status field, IR[4], contains a logic 0 when the device is busy performing an erase or programming operation; otherwise, it contains a logic 1. The ISC Status field, IR[3], contains logic 1 if the device is currently in In-System Configuration (ISC) mode; otherwise, it contains logic 0. The DONE field, IR[2], contains logic 1 if the sampled design revision has been successfully programmed; otherwise, a logic 0 indicates incomplete programming. The remaining bits IR[1:0] are set to 01 as defined by IEEE Std. 1149.1. XCFxxS Instruction Register (8 bits wide) The Instruction Register (IR) for the XCFxxS PROM is eight bits wide and is connected between TDI and TDO during an instruction scan sequence. The detailed composition of the instruction capture pattern is illustrated in Table 7, page 8. The instruction capture pattern shifted out of the XCFxxS device includes IR[7:0]. IR[7:5] are reserved bits and are set to a logic 0. The ISC Status field, IR[4], contains logic 1 if the device is currently in In-System Configuration (ISC) mode; otherwise, it contains logic 0. The Security field, IR[3], contains logic 1 if the device has been programmed with the security option turned on; otherwise, it contains logic 0. IR[2] is unused, and is set to '0'. The remaining bits IR[1:0] are set to '01' as defined by IEEE Std. 1149.1. DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 7 R Platform Flash In-System Programmable Configuration PROMs Table 7: XCFxxS Instruction Capture Values Loaded into IR as part of an Instruction Scan Sequence TDI IR[7:5] Reserved IR[4] ISC Status IR[3] Security IR[2] 0 IR[1:0] 01 TDO Table 8: XCFxxP Instruction Capture Values Loaded into IR as part of an Instruction Scan Sequence IR[15:9] TDI Reserved IR[8:7] ISC Error IR[6:5] ER/PROG Error IR[4] ER/PROG Status IR[3] ISC Status IR[2] DONE IR[1:0] 01 TDO Boundary-Scan Register The Boundary-Scan register is used to control and observe the state of the device pins during the EXTEST, SAMPLE/PRELOAD, and CLAMP instructions. Each output pin on the Platform Flash PROM has two register stages which contribute to the Boundary-Scan register, while each input pin has only one register stage. The bidirectional pins have a total of three register stages which contribute to the Boundary-Scan register. For each output pin, the register stage nearest to TDI controls and observes the output state, and the second stage closest to TDO controls and observes the High-Z enable state of the output pin. For each input pin, a single register stage controls and observes the input state of the pin. The bidirectional pin combines the three bits, the input stage bit is first, followed by the output stage bit and finally the output enable stage bit. The output enable stage bit is closest to TDO. See Table 13, page 37 and Table 14, page 39 for the Boundary-Scan bit order for all connected device pins, or see the appropriate BSDL file for the complete Boundary-Scan bit order description under the "attribute BOUNDARY_REGISTER" section in the BSDL file. The bit assigned to Boundary-Scan cell 0 is the LSB in the BoundaryScan register, and is the register bit closest to TDO. The LSB of the IDCODE register is always read as logic 1 as defined by IEEE Std. 1149.1. Table 9: IDCODES Assigned to Platform Flash PROMs Device XCF01S XCF02S XCF04S XCF08P XCF16P XCF32P Notes: 1. The IDCODE (1) (hex) USERCODE Register The USERCODE instruction gives access to a 32-bit user programmable scratch pad typically used to supply information about the device's programmed contents. By using the USERCODE instruction, a user-programmable identification code can be shifted out for examination. This code is loaded into the USERCODE register during programming of the Platform Flash PROM. If the device is blank or was not loaded during programming, the USERCODE register contains FFFFFFFFh. Identification Registers IDCODE Register The IDCODE is a fixed, vendor-assigned value that is used to electrically identify the manufacturer and type of the device being addressed. The IDCODE register is 32 bits wide. The IDCODE register can be shifted out for examination by using the IDCODE instruction. The IDCODE is available to any other system component via JTAG. Table 9 lists the IDCODE register values for the Platform Flash PROMs. The IDCODE register has the following binary format: vvvv:ffff:ffff:aaaa:aaaa:cccc:cccc:ccc1 Customer Code Register For the XCFxxP Platform Flash PROM, in addition to the USERCODE, a unique 32-byte Customer Code can be assigned to each design revision enabled for the PROM. The Customer Code is set during programming, and is typically used to supply information about the design revision contents. A private JTAG instruction is required to read the Customer Code. If the PROM is blank, or the Customer Code for the selected design revision was not loaded during programming, or if the particular design revision is erased, the Customer Code contains all ones. where v = the die version number f = the PROM family code a = the specific Platform Flash PROM product ID c = the Xilinx manufacturer's ID DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 8 R Platform Flash In-System Programmable Configuration PROMs Platform Flash PROM TAP Characteristics The Platform Flash PROM family performs both in-system programming and IEEE 1149.1 Boundary-Scan (JTAG) testing via a single 4-wire Test Access Port (TAP). This simplifies system designs and allows standard Automatic Test Equipment to perform both functions. The AC characteristics of the Platform Flash PROM TAP are described as follows. X-Ref Target - Figure 4 TAP Timing Figure 4 shows the timing relationships of the TAP signals. These TAP timing characteristics are identical for both Boundary-Scan and ISP operations. TCKMIN TCK TMSS TMSH TMS TDIS TDIH TDI TDOV TDO DS123_04_031808 Figure 4: Test Access Port Timing TAP AC Parameters Table 10 shows the timing parameters for the TAP waveforms shown in Figure 4. Table 10: Test Access Port Timing Parameters Symbol TCKMIN TMSS TMSH TDIS TDIH TDOV Description TCK minimum clock period when VCCJ = 2.5V or 3.3V TMS setup time when VCCJ = 2.5V or 3.3V TMS hold time when VCCJ = 2.5V or 3.3V TDI setup time when VCCJ = 2.5V or 3.3V TDI hold time when VCCJ = 2.5V or 3.3V TDO valid delay when VCCJ = 2.5V or 3.3V Min 67 8 25 8 25 - Max - - - - - 22 Units ns ns ns ns ns ns DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 9 R Platform Flash In-System Programmable Configuration PROMs Additional Features for the XCFxxP Internal Oscillator The 8/16/32 Mbit XCFxxP Platform Flash PROMs include an optional internal oscillator which can be used to drive the CLKOUT and DATA pins on FPGA configuration interface. The internal oscillator can be enabled when programming the PROM, and the oscillator can be set to either the default frequency or to a slower frequency ("XCFxxP PROM as Configuration Master with Internal Oscillator as Clock Source," page 34). FPGA configuration when using a XCFxxP PROM programmed with a compressed bitstream. Compression rates vary depending on several factors, including the target device family and the target design contents. The decompression option is enabled during the PROM programming sequence. The PROM decompresses the stored data before driving both clock and data onto the FPGA's configuration interface. If Decompression is enabled, then the Platform Flash clock output pin (CLKOUT) must be used as the clock signal for the configuration interface, driving the target FPGA's configuration clock input pin (CCLK). Either the PROM's CLK input pin or the internal oscillator must be selected as the source for CLKOUT. Any target FPGA connected to the PROM must operate as slave in the configuration chain, with the configuration mode set to Slave Serial mode or Slave SelectMap (parallel) mode. When decompression is enabled, the CLKOUT signal becomes a controlled clock output with a reduced maximum frequency. When decompressed data is not ready, the CLKOUT pin is put into a high-Z state and must be pulled High externally to provide a known state. The BUSY input is automatically disabled when decompression is enabled. See the "Decompression Setups" section in the Platform Flash PROM User Guide for setup details. CLKOUT The 8/16/32 Mbit XCFxxP Platform Flash PROMs include the programmable option to enable the CLKOUT signal which allows the PROM to provide a source synchronous clock aligned to the data on the configuration interface. The CLKOUT signal is derived from one of two clock sources: the CLK input pin or the internal oscillator. The input clock source is selected during the PROM programming sequence. Output data is available on the rising edge of CLKOUT. The CLKOUT signal is enabled during programming, and is active when CE is Low and OE/RESET is High. On CE rising edge transition, if OE/RESET is High and the PROM terminal count has not been reached, then CLKOUT remains active for an additional eights clock cycles before being disabled. On a OE/RESET falling edge transition, CLKOUT is immediately disabled. When disabled, the CLKOUT pin is put into a high-impedance state and should be pulled High externally to provide a known state. When cascading Platform Flash PROMs with CLKOUT enabled, after completing it's data transfer, the first PROM disables CLKOUT and drives the CEO pin enabling the next PROM in the PROM chain. The next PROM begins driving the CLKOUT signal once that PROM is enabled and data is available for transfer. During high-speed parallel configuration without compression, the FPGA drives the BUSY signal on the configuration interface. When BUSY is asserted High, the PROMs internal address counter stops incrementing, and the current data value is held on the data outputs. While BUSY is High, the PROM continues driving the CLKOUT signal to the FPGA, clocking the FPGA's configuration logic. When the FPGA deasserts BUSY, indicating that it is ready to receive additional configuration data, the PROM begins driving new data onto the configuration interface. Design Revisioning Design Revisioning allows the user to create up to four unique design revisions on a single PROM or stored across multiple cascaded PROMs. Design Revisioning is supported for the 8/16/32 Mbit XCFxxP Platform Flash PROMs in both serial and parallel modes. Design Revisioning can be used with compressed PROM files, and also when the CLKOUT feature is enabled. The PROM programming files along with the revision information files (.cfi) are created using the iMPACT software. The .cfi file is required to enable design revision programming in iMPACT. A single design revision is composed of from 1 to n 8-Mbit memory blocks. If a single design revision contains less than 8 Mbits of data, then the remaining space is padded with all ones. A larger design revision can span several 8-Mbit memory blocks, and any space remaining in the last 8-Mbit memory block is padded with all ones. * A single 32-Mbit PROM contains four 8-Mbit memory blocks, and can therefore store up to four separate design revisions: one 32-Mbit design revision, two 16-Mbit design revisions, three 8-Mbit design revisions, four 8-Mbit design revisions, and so on. Because of the 8-Mbit minimum size requirement for each revision, a single 16-Mbit PROM can only store up to two separate design revisions: one 16-Mbit Decompression The 8/16/32 Mbit XCFxxP Platform Flash PROMs include a built-in data decompressor compatible with Xilinx advanced compression technology. Compressed Platform Flash PROM files are created from the target FPGA bitstream(s) using the iMPACT software. Only Slave Serial and Slave SelectMAP (parallel) configuration modes are supported for * DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 10 R Platform Flash In-System Programmable Configuration PROMs After programming the Platform Flash PROM with a set of design revisions, a particular design revision can be selected using the external REV_SEL[1:0] pins or using the internal programmable design revision control bits. The EN_EXT_SEL pin determines if the external pins or internal bits are used to select the design revision. When EN_EXT_SEL is Low, design revision selection is controlled by the external Revision Select pins, REV_SEL[1:0]. When EN_EXT_SEL is High, design revision selection is controlled by the internal programmable Revision Select control bits. During power up, the design revision selection inputs (pins or control bits) are sampled internally. After power up, the design revision selection inputs are sampled again when any of the following events occur: * * * * On the rising edge of CE On the falling edge of OE/RESET (when CE is Low) On the rising edge of CF (when CE is Low) When reconfiguration is initiated by using the JTAG CONFIG instruction. design revision, one 8-Mbit design revision, or two 8-Mbit design revisions. * A single 8-Mbit PROM can store only one 8-Mbit design revision. Larger design revisions can be split over several cascaded PROMs. For example, two 32-Mbit PROMs can store up to four separate design revisions: one 64-Mbit design revision, two 32-Mbit design revisions, three 16-Mbit design revisions, four 16-Mbit design revisions, and so on. When cascading one 16-Mbit PROM and one 8-Mbit PROM, there are 24 Mbits of available space, and therefore up to three separate design revisions can be stored: one 24-Mbit design revision, two 8-Mbit design revisions, or three 8-Mbit design revisions. See Figure 5 for a few basic examples of how multiple revisions can be stored. The design revision partitioning is handled automatically during file generation in iMPACT. During the PROM file creation, each design revision is assigned a revision number: Revision 0 = '00' Revision 1 = '01' Revision 2 = '10' Revision 3 = '11' X-Ref Target - Figure 5 The data from the selected design revision is then presented on the FPGA configuration interface. PROM 0 REV 0 (8 Mbits) PROM 0 REV 0 (8 Mbits) PROM 0 PROM 0 REV 0 (8 Mbits) PROM 0 REV 0 (16 Mbits) REV 1 (8 Mbits) REV 1 (8 Mbits) REV 0 (32 Mbits) REV 2 (8 Mbits) REV 2 (16 Mbits) REV 3 (8 Mbits) REV 1 (16 Mbits) REV 1 (24 Mbits) 4 Design Revisions 3 Design Revisions 2 Design Revisions 1 Design Revision (a) Design Revision storage examples for a single XCF32P PROM PROM 0 REV 0 (16 Mbits) PROM 0 REV 0 (16 Mbits) REV 0 (32 Mbits) REV 1 (16 Mbits) REV 1 (16 Mbits) REV 1 (16 Mbits) PROM 0 PROM 0 REV 0 (16 Mbits) REV 0 (32 Mbits) PROM 0 PROM 1 REV 2 (16 Mbits) PROM 1 PROM 1 PROM 1 PROM 1 REV 2 (32 Mbits) REV 3 (16 Mbits) REV 1 (32 Mbits) REV 1 (32 Mbits) REV 0 (32 Mbits) 4 Design Revisions 3 Design Revisions 2 Design Revisions 1 Design Revision ds123_20_102103 (b) Design Revision storage examples spanning two XCF32P PROMs Figure 5: Design Revision Storage Examples DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 11 R Platform Flash In-System Programmable Configuration PROMs PROM to FPGA Configuration Mode and Connections Summary The FPGA's I/O, logical functions, and internal interconnections are established by the configuration data contained in the FPGA's bitstream. The bitstream is loaded into the FPGA either automatically upon power up, or on command, depending on the state of the FPGA's mode pins. Xilinx Platform Flash PROMs are designed to download directly to the FPGA configuration interface. FPGA configuration modes which are supported by the XCFxxS Platform Flash PROMs include: Master Serial and Slave Serial. FPGA configuration modes which are supported by the XCFxxP Platform Flash PROMs include: Master Serial, Slave Serial, Master SelectMAP, and Slave SelectMAP. Below is a short summary of the supported FPGA configuration modes. See the respective FPGA data sheet for device configuration details, including which configuration modes are supported by the targeted FPGA device. * The PROM CE input can be driven from the DONE pin. The CE input of the first (or only) PROM can be driven by the DONE output of all target FPGA devices, provided that DONE is not permanently grounded. CE can also be permanently tied Low, but this keeps the DATA output active and causes an unnecessary ICC active supply current ("DC Characteristics Over Operating Conditions," page 28). The PROM CF pin is typically connected to the FPGA's PROG_B (or PROGRAM) input. For the XCFxxP only, the CF pin is a bidirectional pin. If the XCFxxP CF pin is not connected to the FPGA's PROG_B (or PROGRAM) input, then the pin should be tied High. * FPGA Slave Serial Mode In Slave Serial mode, the FPGA loads the configuration bitstream in bit-serial form from external memory synchronized by an externally supplied clock. Upon power-up or reconfiguration, the FPGA's mode select pins are used to select the Slave Serial configuration mode. Slave Serial Mode provides a simple configuration interface. Only a serial data line, a clock line, and two control lines (INIT and DONE) are required to configure an FPGA. Data from the PROM is read out sequentially on a single data line (DIN), accessed via the PROM's internal address counter which is incremented on every valid rising edge of CCLK. The serial bitstream data must be set up at the FPGA's DIN input pin a short time before each rising edge of the externally provided CCLK. Connecting the FPGA device to the configuration PROM for Slave Serial Configuration Mode (Figure 7, page 17): * * * * The DATA output of the PROM(s) drive the DIN input of the lead FPGA device. The PROM CLKOUT (for XCFxxP only) or an external clock source drives the FPGA's CCLK input. The CEO output of a PROM drives the CE input of the next PROM in a daisy chain (if any). The OE/RESET pins of all PROMs are connected to the INIT_B (or INIT) pins of all FPGA devices. This connection assures that the PROM address counter is reset before the start of any (re)configuration. The PROM CE input can be driven from the DONE pin. The CE input of the first (or only) PROM can be driven by the DONE output of all target FPGA devices, provided that DONE is not permanently grounded. CE can also be permanently tied Low, but this keeps the DATA output active and causes an unnecessary ICC active supply current ("DC Characteristics Over Operating Conditions," page 28). The PROM CF pin is typically connected to the FPGA's PROG_B (or PROGRAM) input. For the XCFxxP only, the CF pin is a bidirectional pin. If the XCFxxP CF pin is not connected to the FPGA's PROG_B (or PROGRAM) input, then the pin should be tied High. FPGA Master Serial Mode In Master Serial mode, the FPGA automatically loads the configuration bitstream in bit-serial form from external memory synchronized by the configuration clock (CCLK) generated by the FPGA. Upon power-up or reconfiguration, the FPGA's mode select pins are used to select the Master Serial configuration mode. Master Serial Mode provides a simple configuration interface. Only a serial data line, a clock line, and two control lines (INIT and DONE) are required to configure an FPGA. Data from the PROM is read out sequentially on a single data line (DIN), accessed via the PROM's internal address counter which is incremented on every valid rising edge of CCLK. The serial bitstream data must be set up at the FPGA's DIN input pin a short time before each rising edge of the FPGA's internally generated CCLK signal. Typically, a wide range of frequencies can be selected for the FPGA's internally generated CCLK which always starts at a slow default frequency. The FPGA's bitstream contains configuration bits which can switch CCLK to a higher frequency for the remainder of the Master Serial configuration sequence. The desired CCLK frequency is selected during bitstream generation. Connecting the FPGA device to the configuration PROM for Master Serial Configuration Mode (Figure 6, page 16): * * * * The DATA output of the PROM(s) drive the DIN input of the lead FPGA device. The Master FPGA CCLK output drives the CLK input(s) of the PROM(s) The CEO output of a PROM drives the CE input of the next PROM in a daisy chain (if any). The OE/RESET pins of all PROMs are connected to the INIT_B pins of all FPGA devices. This connection assures that the PROM address counter is reset before the start of any (re)configuration. * * DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 12 R Platform Flash In-System Programmable Configuration PROMs Connecting the FPGA device to the configuration PROM for Master SelectMAP (Parallel) Configuration Mode (Figure 9, page 19): * * * * The DATA outputs of the PROM(s) drive the [D0..D7] input of the lead FPGA device. The Master FPGA CCLK output drives the CLK input(s) of the PROM(s) The CEO output of a PROM drives the CE input of the next PROM in a daisy chain (if any). The OE/RESET pins of all PROMs are connected to the INIT_B pins of all FPGA devices. This connection assures that the PROM address counter is reset before the start of any (re)configuration. The PROM CE input can be driven from the DONE pin. The CE input of the first (or only) PROM can be driven by the DONE output of all target FPGA devices, provided that DONE is not permanently grounded. CE can also be permanently tied Low, but this keeps the DATA output active and causes an unnecessary ICC active supply current ("DC Characteristics Over Operating Conditions," page 28). For high-frequency parallel configuration, the BUSY pins of all PROMs are connected to the FPGA's BUSY output (when the FPGA has a BUSY pin and when the use of the FPGA BUSY pin is required). This connection assures that the next data transition for the PROM is delayed until the FPGA is ready for the next configuration data byte. For FPGA BUSY pin requirements, refer to the appropriate FPGA data sheet or FPGA family configuration user guide. The PROM CF pin is typically connected to the FPGA's PROG_B (or PROGRAM) input. For the XCFxxP only, the CF pin is a bidirectional pin. If the XCFxxP CF pin is not connected to the FPGA's PROG_B (or PROGRAM) input, then the pin should be tied High. Serial Daisy Chain Multiple FPGAs can be daisy-chained for serial configuration from a single source. After a particular FPGA has been configured, the data for the next device is routed internally to the FPGA's DOUT pin. Typically the data on the DOUT pin changes on the falling edge of CCLK, although for some devices the DOUT pin changes on the rising edge of CCLK. Consult the respective device data sheets for detailed information on a particular FPGA device. For clocking the daisy-chained configuration, either the first FPGA in the chain can be set to Master Serial, generating the CCLK, with the remaining devices set to Slave Serial (Figure 8, page 18), or all the FPGA devices can be set to Slave Serial and an externally generated clock can be used to drive the FPGA's configuration interface (Figure 7, page 17 or Figure 12, page 22). * FPGA Master SelectMAP (Parallel) Mode (XCFxxP PROM Only) In Master SelectMAP mode, byte-wide data is written into the FPGA, typically with a BUSY flag controlling the flow of data, synchronized by the configuration clock (CCLK) generated by the FPGA. Upon power-up or reconfiguration, the FPGA's mode select pins are used to select the Master SelectMAP configuration mode. The configuration interface typically requires a parallel data bus, a clock line, and two control lines (INIT and DONE). In addition, the FPGA's Chip Select, Write, and BUSY pins must be correctly controlled or monitored to enable SelectMAP configuration. The configuration data is read from the PROM byte by byte on pins [D0..D7], accessed via the PROM's internal address counter which is incremented on every valid rising edge of CCLK. The bitstream data must be set up at the FPGA's [D0..D7] input pins a short time before each rising edge of the FPGA's internally generated CCLK signal. If BUSY is asserted (High) by the FPGA, the configuration data must be held until BUSY goes Low. The FPGA's active-Low Chip Select (CS or CS_B) and active-Low Write (WRITE or RDWR_B) signals must be tied to ground to enable the FPGA's SelectMAP configuration process. The Master SelectMAP configuration interface is clocked by the FPGA's internal oscillator. Typically, a wide range of frequencies can be selected for the internally generated CCLK which always starts at a slow default frequency. The FPGA's bitstream contains configuration bits which can switch CCLK to a higher frequency for the remainder of the Master SelectMAP configuration sequence. The desired CCLK frequency is selected during bitstream generation. After configuration, the pins of the SelectMAP port can be used as additional user I/O. Alternatively, the port can be retained using the persist option. * * FPGA Slave SelectMAP (Parallel) Mode (XCFxxP PROM Only) In Slave SelectMAP mode, byte-wide data is written into the FPGA, typically with a BUSY flag controlling the flow of data, synchronized by an externally supplied configuration clock (CCLK). Upon power-up or reconfiguration, the FPGA's mode select pins are used to select the Slave SelectMAP configuration mode. The configuration interface typically requires a parallel data bus, a clock line, and two control lines (INIT and DONE). In addition, the FPGA's Chip Select, Write, and BUSY pins must be correctly controlled or monitored to enable SelectMAP configuration. The configuration data is read from the PROM byte by byte on pins [D0..D7], accessed via the PROM's internal address counter which is incremented on every valid rising edge of CCLK. The bitstream data must be set up at the FPGA's [D0..D7] input pins a short time before each rising edge of the provided DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 13 R Platform Flash In-System Programmable Configuration PROMs selected does not require the use of the BUSY signal, the CS_B pins can be connected to a common line so all of the devices are configured simultaneously (Figure 10). With additional control logic, the individual devices can be loaded separately by asserting the CS_B pin of each device in turn and then enabling the appropriate configuration data. The PROM can also store the individual bitstreams for each FPGA for SelectMAP configuration in separate design revisions. When design revisioning is utilized, additional control logic can be used to select the appropriate bitstream by asserting the EN_EXT_SEL pin, and using the REV_SEL[1:0] pins to select the required bitstream, while asserting the CS_B pin for the FPGA the bitstream is targeting (Figure 13, page 23). For clocking the parallel configuration chain, either the first FPGA in the chain can be set to Master SelectMAP, generating the CCLK, with the remaining devices set to Slave SelectMAP, or all the FPGA devices can be set to Slave SelectMAP and an externally generated clock can be used to drive the configuration interface. Again, the respective device data sheets should be consulted for detailed information on a particular FPGA device, including which configuration modes are supported by the targeted FPGA device. CCLK. If BUSY is asserted (High) by the FPGA, the configuration data must be held until BUSY goes Low. The FPGA's active-Low Chip Select (CS or CS_B) and active-Low Write (WRITE or RDWR_B) signals must be tied to ground to enable the FPGA's SelectMAP configuration process. After configuration, the pins of the SelectMAP port can be used as additional user I/O. Alternatively, the port can be retained using the persist option. Connecting the FPGA device to the configuration PROM for Slave SelectMAP (Parallel) Configuration Mode (Figure 10, page 20): * * * * The DATA outputs of the PROM(s) drives the [D0..D7] inputs of the lead FPGA device. The PROM CLKOUT (for XCFxxP only) or an external clock source drives the FPGA's CCLK input. The CEO output of a PROM drives the CE input of the next PROM in a daisy chain (if any). The OE/RESET pins of all PROMs are connected to the INIT_B pins of all FPGA devices. This connection assures that the PROM address counter is reset before the start of any (re)configuration. The PROM CE input can be driven from the DONE pin. The CE input of the first (or only) PROM can be driven by the DONE output of all target FPGA devices, provided that DONE is not permanently grounded. CE can also be permanently tied Low, but this keeps the DATA output active and causes an unnecessary ICC active supply current ("DC Characteristics Over Operating Conditions," page 28). For high-frequency parallel configuration, the BUSY pins of all PROMs are connected to the FPGA's BUSY output (when the FPGA has a BUSY pin and when the use of the FPGA BUSY pin is required). This connection assures that the next data transition for the PROM is delayed until the FPGA is ready for the next configuration data byte. For FPGA BUSY pin requirements, refer to the appropriate FPGA data sheet or FPGA family configuration user guide. The PROM CF pin is typically connected to the FPGA's PROG_B (or PROGRAM) input. For the XCFxxP only, the CF pin is a bidirectional pin. If the XCFxxP CF pin is not connected to the FPGA's PROG_B (or PROGRAM) input, then the pin should be tied High. * Cascading Configuration PROMs When configuring multiple FPGAs in a serial daisy chain, configuring multiple FPGAs in a SelectMAP parallel chain, or configuring a single FPGA requiring a larger configuration bitstream, cascaded PROMs provide additional memory (Figure 8, page 18, Figure 11, page 21, Figure 12, page 22, and Figure 12, page 22). Multiple Platform Flash PROMs can be concatenated by using the CEO output to drive the CE input of the downstream device. The clock signal and the data outputs of all Platform Flash PROMs in the chain are interconnected. After the last data from the first PROM is read, the first PROM asserts its CEO output Low and drives its outputs to a high-impedance state. The second PROM recognizes the Low level on its CE input and immediately enables its outputs. After configuration is complete, address counters of all cascaded PROMs are reset if the PROM OE/RESET pin goes Low or CE goes High. When utilizing the advanced features for the XCFxxP Platform Flash PROM, including the clock output (CLKOUT) option, decompression option, or design revisioning, programming files which span cascaded PROM devices can only be created for cascaded chains containing only XCFxxP PROMs. If the advanced features are not used, then cascaded PROM chains can contain both XCFxxP and XCFxxS PROMs. * * FPGA SelectMAP (Parallel) Device Chaining (XCFxxP PROM Only) Multiple Virtex-II FPGAs can be configured using the SelectMAP mode, and be made to start up simultaneously. To configure multiple devices in this way, wire the individual CCLK, DONE, INIT, Data ([D0..D7]), Write (WRITE or RDWR_B), and BUSY pins of all the devices in parallel. If all devices are to be configured with the same bitstream, readback is not being used, and the CCLK frequency DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 14 R Platform Flash In-System Programmable Configuration PROMs The iMPACT software can issue the JTAG CONFIG command to initiate FPGA configuration by setting the "Load FPGA" option. When using the XCFxxP Platform Flash PROM with design revisioning enabled, the CF pin should always be connected to the PROG_B (or PROGRAM) pin on the FPGA to ensure that the current design revision selection is sampled when the FPGA is reset. The XCFxxP PROM samples the current design revision selection from the external REV_SEL pins or the internal programmable Revision Select bits on the rising edge of CF. When the JTAG CONFIG command is executed, the XCFxxP samples the new design revision selection before initiating the FPGA configuration sequence. When using the XCFxxP Platform Flash PROM without design revisioning, if the CF pin is not connected to the FPGA PROG_B (or PROGRAM) pin, then the XCFxxP CF pin must be tied High. Initiating FPGA Configuration The options for initiating FPGA configuration via the Platform Flash PROM include: * * * Automatic configuration on power up Applying an external PROG_B (or PROGRAM) pulse Applying the JTAG CONFIG instruction Following the FPGA's power-on sequence or the assertion of the PROG_B (or PROGRAM) pin the FPGA's configuration memory is cleared, the configuration mode is selected, and the FPGA is ready to accept a new configuration bitstream. The FPGA's PROG_B pin can be controlled by an external source, or alternatively, the Platform Flash PROMs incorporate a CF pin that can be tied to the FPGA's PROG_B pin. Executing the CONFIG instruction through JTAG pulses the CF output Low once for 300-500 ns, resetting the FPGA and initiating configuration. DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 15 R Platform Flash In-System Programmable Configuration PROMs Configuration PROM to FPGA Device Interface Connection Diagrams X-Ref Target - Figure 6 VCCO(2) 4.7 k 4.7 k (1) VCCJ VCCO VCCINT VCCINT VCCO VCCJ (2) (2) D0 DIN MODE PINS (1) DIN CCLK Platform Flash PROM CLK CE CEO OE/RESET TDI TMS TCK TDO TDO GND TDI TDI TMS TCK CF (3) Xilinx FPGA Master Serial CCLK DONE DOUT INIT_B PROG_B DONE INIT_B PROG_B ...OPTIONAL Slave FPGAs with identical configurations DIN CCLK DONE INIT_B PROG_B ...OPTIONAL Daisy-chained Slave FPGAs with different configurations TMS TCK TDO GND Notes: 1 For Mode pin connections and DONE pin pull-up value, refer to the appropriate FPGA data sheet or FPGA family configuration user guide. 2 For compatible voltages, refer to the appropriate data sheet. 3 For the XCFxxS the CF pin is an output pin. For the XCFxxP the CF pin is a bidirectional pin. For the XCFxxP, if CF is not connected to PROG_B, then it must be tied to VCCO via a 4.7 k pull-up resistor. ds123_11_111106 Figure 6: Configuring in Master Serial Mode DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 16 R Platform Flash In-System Programmable Configuration PROMs X-Ref Target - Figure 7 VCCO External (3) Oscillator 4.7 k (2) 4.7 k (1) VCCJ VCCO VCCINT VCCINT VCCO(2) VCCJ (2) D0 DIN MODE PINS (1) DIN CCLK Platform Flash PROM CLK (3) Xilinx FPGA Slave Serial CCLK DONE DOUT INIT_B PROG_B DONE INIT_B PROG_B ...OPTIONAL Slave FPGAs with identical configurations CE CEO OE/RESET TDI TMS TCK TDO TDO GND TDI TMS TCK CF (4) DIN CCLK DONE INIT_B PROG_B ...OPTIONAL Daisy-chained Slave FPGAs with different configurations TDI TMS TCK TDO GND Notes: 1 For Mode pin connections and DONE pin pull-up value, refer to the appropriate FPGA data sheet or FPGA family configuration user guide. 2 For compatible voltages, refer to the appropriate data sheet. 3 In Slave Serial mode, the configuration interface can be clocked by an external oscillator, or optionally--for the XCFxxP Platform Flash PROM only--the CLKOUT signal can be used to drive the FPGA's configuration clock (CCLK). If the XCFxxP PROM's CLKOUT signal is used, then CLKOUT must be tied to a 4.7K resistor pulled up to VCCO. 4 For the XCFxxS the CF pin is an output pin. For the XCFxxP the CF pin is a bidirectional pin. For the XCFxxP, if CF is not connected to PROG_B, then it must be tied to VCCO via a 4.7 k pull-up resistor. ds123_12_110707 Figure 7: Configuring in Slave Serial Mode DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 17 R Platform Flash In-System Programmable Configuration PROMs X-Ref Target - Figure 8 VCCJ VCCO VCCINT VCCJ VCCO VCCINT VCCO(2) 4.7 k 4.7 k (1) VCCINT VCCO (2) D0 VCCINT VCCO(2) VCCJ(2) D0 DIN MODE PINS (1) MODE PINS DIN (1) DOUT VCCJ(2) Platform Flash PROM Cascaded PROM (PROM 1) TDI TMS TCK TDO CLK CE CEO OE/RESET TDI TMS TCK TDO CF (3) Platform Flash PROM First PROM (PROM 0) CLK CE CEO OE/RESET CF TDI TMS TCK TDO TDI (3) Xilinx FPGA Master Serial CCLK DONE INIT_B PROG_B Xilinx FPGA Slave Serial CCLK DONE INIT_B PROG_B TDO TDI TMS TCK TDO GND GND TMS TCK GND GND Notes: 1 For Mode pin connections and DONE pin pull-up value, refer to the appropriate FPGA data sheet or FPGA family configuration user guide. 2 For compatible voltages, refer to the appropriate data sheet. 3 For the XCFxxS the CF pin is an output pin. For the XCFxxP the CF pin is a bidirectional pin. For the XCFxxP, if CF is not connected to PROG_B, then it must be tied to VCCO via a 4.7 k pull-up resistor. ds123_13_093006 Figure 8: Configuring Multiple Devices in Master/Slave Serial Mode DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 18 R Platform Flash In-System Programmable Configuration PROMs X-Ref Target - Figure 9 VCCO (2) 4.7 k 4.7 k (1) VCCJ VCCO VCCINT VCCINT VCCO (2) D[0:7] D[0:7] MODE PINS (1) RDWR_B CS_B VCCJ(2) XCFxxP Platform Flash PROM CLK CE CEO OE/RESET TDI TMS TCK TDO TDO GND TDI TMS TCK CF (4) Xilinx FPGA Master SelectMAP CCLK DONE D[0:7] INIT_B PROG_B BUSY(3) CCLK DONE INIT_B PROG_B BUSY TDI TMS TCK TDO (3) BUSY(3) ...OPTIONAL Slave FPGAs with identical configurations GND Notes: 1 For Mode pin connections and DONE pin pull-up value, refer to the appropriate FPGA data sheet or FPGA family configuration user guide. 2 For compatible voltages, refer to the appropriate data sheet. 3 The BUSY pin is only available with the XCFxxP Platform Flash PROM (only certain FPGA families require the BUSY pin connection for high-frequency SelectMAP mode configuration). For FPGAs that do not have a BUSY pin or do not use their BUSY pin during configuration, the Platform Flash PROM BUSY pin should be unconnected or grounded. For BUSY pin requirements, refer to the appropriate FPGA data sheet or FPGA family configuration user guide. 4 For the XCFxxP the CF pin is a bidirectional pin. For the XCFxxP, if CF is not connected to PROG_B, then it must be tied to VCCO via a 4.7 k pull-up resistor. ds123_14_110707 Figure 9: Configuring in Master SelectMAP Mode DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 19 R Platform Flash In-System Programmable Configuration PROMs X-Ref Target - Figure 10 VCCO(2) External Oscillator 4.7 k 4.7 k (1) VCCJ VCCO VCCINT VCCINT VCCO VCCJ (2) (2) D[0:7] D[0:7] MODE PINS (1) RDWR_B CS_B XCFxxP Platform Flash PROM CLK CE CEO OE/RESET TDI TMS TCK TDO TDO GND TDI TMS TCK CF (4) Xilinx FPGA Slave SelectMAP CCLK DONE D[0:7] INIT_B PROG_B BUSY(3) CCLK DONE INIT_B PROG_B BUSY TDI TMS TCK TDO (3) BUSY(3) Optional slave FPGAs with identical configurations GND Notes: 1 For Mode pin connections and DONE pin pull-up value, refer to the appropriate FPGA data sheet or FPGA family configuration user guide. 2 For compatible voltages, refer to the appropriate data sheet. 3 The BUSY pin is only available with the XCFxxP Platform Flash PROM (only certain FPGA families require the BUSY pin connection for high-frequency SelectMAP mode configuration). For FPGAs that do not have a BUSY pin or do not use their BUSY pin during configuration, the Platform Flash PROM BUSY pin should be unconnected or grounded. For BUSY pin requirements, refer to the appropriate FPGA data sheet or FPGA family configuration user guide. 4 For the XCFxxP the CF pin is a bidirectional pin. For the XCFxxP, if CF is not connected to PROG_B, then it must be tied to VCCO via a 4.7 k pull-up resistor. ds123_15_110707 Figure 10: Configuring in Slave SelectMAP Mode DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 20 R Platform Flash In-System Programmable Configuration PROMs X-Ref Target - Figure 11 VCCJ VCCO VCCINT VCCJ VCCO VCCINT VCCO(2) 4.7 k 4.7 k (1) VCCINT VCCO(2) VCCJ(2) D[0:7] VCCINT VCCO(2) VCCJ(2) D[0:7] D[0:7] MODE PINS(1) RDWR_B CS_B D[0:7] MODE PINS(1) RDWR_B CS_B XCFxxP Platform Flash PROM Cascaded PROM (PROM 1) TDI TMS TCK TDO GND TDI TMS TCK CLK CE CEO CF (4) XCFxxP Platform Flash PROM First PROM (PROM 0) CLK CE CEO Xilinx FPGA Master SelectMAP CCLK DONE INIT_B PROG_B BUSY (3) Xilinx FPGA Slave SelectMAP CCLK DONE INIT_B PROG_B BUSY (3) OE/RESET BUSY(3) TDO TDI TMS TCK GND OE/RESET CF BUSY (4) (3) TDO TDO TDI TMS TCK TDI TMS TCK TDO GND GND Notes: 1 For Mode pin connections and DONE pin pull-up value, refer to the appropriate FPGA data sheet or FPGA family configuration user guide. 2 For compatible voltages, refer to the appropriate data sheet. 3 The BUSY pin is only available with the XCFxxP Platform Flash PROM (only certain FPGA families require the BUSY pin connection for high-frequency SelectMAP mode configuration). For FPGAs that do not have a BUSY pin or do not use their BUSY pin during configuration, the Platform Flash PROM BUSY pin should be unconnected or grounded. For BUSY pin requirements, refer to the appropriate FPGA data sheet or FPGA family configuration user guide. 4 For the XCFxxP the CF pin is a bidirectional pin. For the XCFxxP, if CF is not connected to PROG_B, then it must be tied to VCCO via a 4.7 k pull-up resistor. DS123_16_110707 Figure 11: Configuring Multiple Devices with Identical Patterns in Master/Slave SelectMAP Mode DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 21 R Platform Flash In-System Programmable Configuration PROMs X-Ref Target - Figure 12 VCCJ VCCO VCCINT VCCJ VCCO VCCINT VCCO(2) External Oscillator 4.7 k 4.7 k (1) VCCINT VCCO(2) VCCJ(2) D0 VCCINT VCCO(2) VCCJ(2) D0 DIN MODE PINS(1) DOUT DIN MODE PINS(1) XCFxxP Platform Flash PROM Cascaded PROM (PROM 1) TDI TMS TCK TDO TDI TMS TCK TDO CLK CE CEO CF (3) XCFxxP Platform Flash PROM First PROM (PROM 0) CLK CE CEO Xilinx FPGA Slave Serial CCLK DONE INIT_B PROG_B Xilinx FPGA Slave Serial CCLK DONE INIT_B PROG_B OE/RESET OE/RESET CF TDI TMS TCK TDO (3) TDI TMS TCK TDI TMS TCK TDO EN_EXT_SEL REV_SEL[1:0] GND EN_EXT_SEL REV_SEL[1:0] GND GND GND EN_EXT_SEL Design Revision Control Logic REV_SEL[1:0] DONE CF / PROG_B Notes 1. For Mode pin connections and DONE pin pull-up value, refer to the appropriate FPGA data sheet or FPGA family configuration user guide. 2. For compatible voltages, refer to the appropriate data sheet. 3. For the XCFxxP the CF pin is a bidirectional pin. For the XCFxxP, if CF is not connected to PROG_B, then it must be tied to VCCO via a 4.7 k pull-up resistor. ds123_17_110807 Figure 12: Configuring Multiple Devices with Design Revisioning in Slave Serial Mode DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 22 R Platform Flash In-System Programmable Configuration PROMs X-Ref Target - Figure 13 VCCJ VCCO VCCINT VCCJ VCCO VCCINT VCCO(2) External Oscillator 4.7 k 4.7 k (1) VCCINT VCCO(2) VCCJ(2) D[0:7] VCCINT VCCO(2) VCCJ(2) D[0:7] D[0:7] MODE PINS(1) RDWR_B CS_B D[0:7] MODE PINS(1) RDWR_B CS_B XCFxxP Platform Flash PROM Cascaded PROM (PROM 1) TDI TMS TCK TDO TDI TMS TCK CLK CE CEO CF BUSY (4) (3) XCFxxP Platform Flash PROM First PROM (PROM 0) CLK CE CEO Xilinx FPGA Slave SelectMAP CCLK DONE INIT_B PROG_B BUSY (3) Xilinx FPGA Slave SelectMAP CCLK DONE INIT_B PROG_B BUSY (3) OE/RESET OE/RESET CF BUSY TDI TMS TCK TDO (4) (3) TDO TDI TMS TCK TDO TDI TMS TCK TDO EN_EXT_SEL REV_SEL[1:0] GND EN_EXT_SEL REV_SEL[1:0] GND GND GND EN_EXT_SEL Design Revision Control Logic REV_SEL[1:0] CF DONE PROG_B CS_B[1:0] Notes: 1. For Mode pin connections and DONE pin pull-up value, refer to the appropriate FPGA data sheet or FPGA family configuration user guide. 2. For compatible voltages, refer to the appropriate data sheet. 3. The BUSY pin is only available with the XCFxxP Platform Flash PROM (only certain FPGA families require the BUSY pin connection for high-frequency SelectMAP mode configuration). For FPGAs that do not have a BUSY pin or do not use their BUSY pin during configuration, the Platform Flash PROM BUSY pin should be unconnected or grounded. For BUSY pin requirements, refer to the appropriate FPGA data sheet or FPGA family configuration user guide. 4. For the XCFxxP the CF pin is a bidirectional pin. For the XCFxxP, if CF is not connected to PROG_B, then it must be tied to VCCO via a 4.7 k pull-up resistor ds123_18_110707 Figure 13: Configuring Multiple Devices with Design Revisioning in Slave SelectMAP Mode DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 23 R Platform Flash In-System Programmable Configuration PROMs Reset and Power-On Reset Activation At power up, the device requires the VCCINT power supply to monotonically rise to the nominal operating voltage within the specified VCCINT rise time. If the power supply cannot meet this requirement, then the device might not perform power-on reset properly. During the power-up sequence, OE/RESET is held Low by the PROM. Once the required supplies have reached their respective POR (Power On Reset) thresholds, the OE/RESET release is delayed (TOER minimum) to allow more margin for the power supplies to stabilize before initiating configuration. The OE/RESET pin is connected to an external 4.7 k pull-up resistor and also to the target FPGA's INIT pin. For systems utilizing slowrising power supplies, an additional power monitoring circuit can be used to delay the target configuration until the system power reaches minimum operating voltages by holding the OE/RESET pin Low. When OE/RESET is released, the FPGA's INIT pin is pulled High allowing the FPGA's configuration sequence to begin. If the power drops X-Ref Target - Figure 14 below the power-down threshold (VCCPD), the PROM resets and OE/RESET is again held Low until the after the POR threshold is reached. OE/RESET polarity is not programmable. These power-up requirements are shown graphically in Figure 14. For a fully powered Platform Flash PROM, a reset occurs whenever OE/RESET is asserted (Low) or CE is deasserted (High). The address counter is reset, CEO is driven High, and the remaining outputs are placed in a high-impedance state. Notes: 1. The XCFxxS PROM only requires VCCINT to rise above its POR threshold before releasing OE/RESET. 2. The XCFxxP PROM requires both VCCINT to rise above its POR threshold and for VCCO to reach the recommended operating voltage level before releasing OE/RESET. VCCINT Recommended Operating Range Delay or Restart Configuration 200 s ramp 50 ms ramp VCCPOR VCCPD A slow-ramping VCCINT supply may still be below the minimum operating voltage when OE/RESET is released. In this case, the configuration sequence must be delayed until both VCCINT and VCCO have reached their recommended operating conditions. TIME (ms) TRST ds123_21_103103 TOER TOER Figure 14: Platform Flash PROM Power-Up Requirements I/O Input Voltage Tolerance and Power Sequencing The I/Os on each re-programmable Platform Flash PROM are fully 3.3V-tolerant. This allows 3V CMOS signals to connect directly to the inputs without damage. The core power supply (VCCINT), JTAG pin power supply (VCCJ), output power supply (VCCO), and external 3V CMOS I/O signals can be applied in any order. Additionally, for the XCFxxS PROM only, when VCCO is supplied at 2.5V or 3.3V and VCCINT is supplied at 3.3V, the I/Os are 5V-tolerant. This allows 5V CMOS signals to connect directly to the inputs on a powered XCFxxS PROM without damage. Failure to power the PROM correctly while supplying a 5V input signal can result in damage to the XCFxxS device. DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 24 R Platform Flash In-System Programmable Configuration PROMs Standby Mode The PROM enters a low-power standby mode whenever CE is deasserted (High). In standby mode, the address counter is reset, CEO is driven High, and the remaining outputs are placed in a high-impedance state regardless of the state of the OE/RESET input. For the device to remain in the low-power standby mode, the JTAG pins TMS, TDI, and TDO must not be pulled Low, and TCK must be stopped (High or Low). When using the FPGA DONE signal to drive the PROM CE pin High to reduce standby power after configuration, an external pull-up resistor should be used. Typically a 330 Table 11: Truth Table for XCFxxS PROM Control Inputs Control Inputs OE/RESET High Low X (1) Notes: 1. 2. X = don't care. TC = Terminal Count = highest address value. pull-up resistor is used, but refer to the appropriate FPGA data sheet for the recommended DONE pin pull-up value. If the DONE circuit is connected to an LED to indicate FPGA configuration is complete, and is also connected to the PROM CE pin to enable low-power standby mode, then an external buffer should be used to drive the LED circuit to ensure valid transitions on the PROM's CE pin. If low-power standby mode is not required for the PROM, then the CE pin should be connected to ground. CE Low Low High Internal Address If address < TC (2) : increment If address = TC (2) : don't change Held reset Held reset Outputs DATA Active High-Z High-Z High-Z CEO High Low High High ICC Active Reduced Active Standby Table 12: Truth Table for XCFxxP PROM Control Inputs Control Inputs OE/RESET CE CF BUSY(5) Internal Address If address address < High Low High Low < TC (2) EA (3) : and increment Outputs DATA Active High-Z High-Z Active and Unchanged Active High-Z High-Z CEO High High Low High High High High CLKOUT Active High-Z High-Z Active Active High-Z High-Z ICC Active Reduced Reduced Active Active Active Standby If address < TC (2) and address = EA (3) : don't change Else If address = TC (2) : don't change High High Low X Notes: 1. 2. 3. 4. 5. Low Low Low High High | X X High X (1) X X Unchanged Reset (4) Held Held reset (4) reset (4) X = don't care. TC = Terminal Count = highest address value. For the XCFxxP with Design Revisioning enabled, EA = end address (last address in the selected design revision). For the XCFxxP with Design Revisioning enabled, Reset = address reset to the beginning address of the selected bank. If Design Revisioning is not enabled, then Reset = address reset to address 0. The BUSY input is only enabled when the XCFxxP is programmed for parallel data output and decompression is not enabled. DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 25 R Platform Flash In-System Programmable Configuration PROMs DC Electrical Characteristics Absolute Maximum Ratings Symbol VCCINT VCCO VCCJ VIN VTS TSTG TJ Notes: 1. Maximum DC undershoot below GND must be limited to either 0.5V or 10 mA, whichever is easier to achieve. During transitions, the device pins can undershoot to -2.0V or overshoot to +7.0V, provided this over- or undershoot lasts less then 10 ns and with the forcing current being limited to 200 mA. Stresses beyond those listed under Absolute Maximum Ratings might cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time adversely affects device reliability. For soldering guidelines, see the information on "Packaging and Thermal Characteristics" at www.xilinx.com. Description Internal supply voltage relative to GND I/O supply voltage relative to GND JTAG I/O supply voltage relative to GND Input voltage with respect to GND VCCO < 2.5V VCCO 2.5V Voltage applied to High-Z output VCCO < 2.5V VCCO 2.5V Storage temperature (ambient) Junction temperature XCF01S, XCF02S, XCF04S -0.5 to +4.0 -0.5 to +4.0 -0.5 to +4.0 -0.5 to +3.6 -0.5 to +5.5 -0.5 to +3.6 -0.5 to +5.5 -65 to +150 +125 XCF08P, XCF16P, XCF32P -0.5 to +2.7 -0.5 to +4.0 -0.5 to +4.0 -0.5 to +3.6 -0.5 to +3.6 -0.5 to +3.6 -0.5 to +3.6 -65 to +150 +125 Units V V V V V V V C C 2. 3. Supply Voltage Requirements for Power-On Reset and Power-Down Symbol TVCC VCCPOR TOER VCCPD TRST Notes: 1. 2. 3. VCCINT, VCCO, and VCCJ supplies can be applied in any order. At power up, the device requires the VCCINT power supply to monotonically rise to the nominal operating voltage within the specified TVCC rise time. If the power supply cannot meet this requirement, then the device might not perform power-on-reset properly. See Figure 14, page 24. If the VCCINT and VCCO supplies do not reach their respective recommended operating conditions before the OE/RESET pin is released, then the configuration data from the PROM is not available at the recommended threshold levels. The configuration sequence must be delayed until both VCCINT and VCCO have reached their recommended operating conditions. Description VCCINT rise time from 0V to nominal OE/RESET release delay following voltage (2) XCF01S, XCF02S, XCF04S Min 0.2 1 0.5 - 10 XCF08P, XCF16P, XCF32P Min 0.2 0.5 0.5 - 10 Units ms V ms V ms Max 50 - 3 1 - Max 50 - 30 0.5 - POR threshold for the VCCINT supply POR (3) Power-down threshold for VCCINT supply Time required to trigger a device reset when the VCCINT supply drops below the maximum VCCPD threshold DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 26 R Platform Flash In-System Programmable Configuration PROMs Recommended Operating Conditions Symbol VCCINT VCCO Supply voltage for output drivers VCCJ Supply voltage for JTAG output drivers Description Internal voltage supply 3.3V Operation 2.5V Operation 1.8V Operation 1.5V Operation 3.3V Operation 2.5V Operation 3.3V Operation Low-level input voltage 2.5V Operation 1.8V Operation 1.5V Operation XCF01S, XCF02S, XCF04S Min 3.0 3.0 2.3 1.7 - 3.0 2.3 0 0 - - 2.0 1.7 70% VCCO - - 0 -40 XCF08P, XCF16P, XCF32P Min 1.65 3.0 2.3 1.7 Typ 3.3 3.3 2.5 1.8 - 3.3 2.5 - - - - - - - - - - - Max 3.6 3.6 2.7 1.9 - 3.6 2.7 0.8 0.7 20% VCCO - 5.5 5.5 3.6 - 500 VCCO 85 Typ 1.8 3.3 2.5 1.8 1.5 Max 2.0 3.6 2.7 1.9 Units V V V V V 3.0 2.3 0 0 - 0 2.0 1.7 70% VCCO - 0 -40 3.3 2.5 - - - - - - - - - - - 3.6 2.7 0.8 0.7 20% VCCO 3.6 3.6 3.6 3.6 500 VCCO 85 V V V V V V V V V V ns V C VIL VIH 3.3V Operation High-level input 2.5V Operation voltage 1.8V Operation 1.5V Operation time(1) TIN VO TA Notes: 1. Input signal transition Output voltage Operating ambient temperature Input signal transition time measured between 10% VCCO and 90% VCCO . Quality and Reliability Characteristics Symbol TDR NPE VESD Data retention Program/erase cycles (Endurance) Electrostatic discharge (ESD) Description Min 20 20,000 2,000 Max - - - Units Years Cycles Volts DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 27 R Platform Flash In-System Programmable Configuration PROMs DC Characteristics Over Operating Conditions Symbol Description XCF01S, XCF02S, XCF04S Test Conditions IOH = -4 mA IOH = -500 A IOH = -50 A - IOL = 4 mA IOL = 500 A IOL = 50 A - 33 MHz 33 MHz - Note (2) Note (3) Note (3) Note (3) VCCJ = max VIN = GND VCCINT = max VCCO = max VIN = GND or VCCO VCCINT = max VCCO = max VIN = GND or VCCO XCF08P, XCF16P, XCF32P Max - - - - 0.4 0.4 0.4 - 10 10 - 5 5 1 1 100 33 MHz 33 MHz 33 MHz Note (2) Note (3) Note (3) Note (3) VCCJ = max VIN = GND VCCINT = max VCCO = max VIN = GND or VCCO VCCINT = max VCCO = max VIN = GND or VCCO VCCINT = max VCCO = max VIN = GND or VCCO VCCINT = max VCCO = max VIN = GND or VCCO Min 2.4 VCCO - 0.4 VCCO - 0.4 Test Conditions IOH = -4 mA IOH = -500 A IOH = -50 A Units Max - - - - V V V V V V V V 10 10 40 5 1 1 1 100 mA mA mA mA mA mA mA A Min 2.4 VCCO - 0.4 VCCO - 0.4 High-level output voltage for 3.3V outputs High-level output voltage for 2.5V outputs VOH High-level output voltage for 1.8V outputs High-level output voltage for 1.5V outputs Low-level output voltage for 3.3V outputs VOL Low-level output voltage for 2.5V outputs Low-level output voltage for 1.8V outputs Low-level output voltage for 1.5V outputs ICCINT ICCO (1) ICCJ ICCINTS ICCOS ICCJS IILJ Internal voltage supply current, active mode Output driver supply current, active serial mode Output driver supply current, active parallel mode JTAG supply current, active mode Internal voltage supply current, standby mode Output driver supply current, standby mode JTAG supply current, standby mode JTAG pins TMS, TDI, and TDO pull-up current - - - - - - - - - - - - - IOL = 4 mA IOL = 500 A IOL = 50 A - - - - - - - - - - - - 0.4 0.4 0.4 IIL Input leakage current -10 10 -10 10 A IIH Input and output High-Z leakage current -10 10 -10 10 A IILP Source current through internal pull-ups on EN_EXT_SEL, REV_SEL0, REV_SEL1 - - - - 100 A IIHP Sink current through internal pull-down on BUSY - - - -100 - A CIN COUT Notes: 1. 2. 3. Input capacitance Output capacitance VIN = GND f = 1.0 MHz VIN = GND f = 1.0 MHz - - 8 14 VIN = GND f = 1.0 MHz VIN = GND f = 1.0 MHz - - 8 14 pF pF Output driver supply current specification based on no load conditions. TDI/TMS/TCK non-static (active). CE High, OE Low, and TMS/TDI/TCK static. DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 28 R Platform Flash In-System Programmable Configuration PROMs AC Electrical Characteristics AC Characteristics Over Operating Conditions XCFxxS and XCFxxP PROM as Configuration Slave with CLK Input Pin as Clock Source X-Ref Target - Figure 15 CE TSCE THCE TCYC TLC THC THOE OE/RESET CLK TSB THB TOH TDF BUSY (optional) DATA TOE TCE TCAC THCF TCF TOH CF EN_EXT_SEL TSXT THXT TSXT THXT REV_SEL[1:0] TSRV THRV TSRV THRV ds123_22_122905 Symbol Description CF hold time to guarantee design revision selection is sampled when VCCO = 3.3V or 2.5V(9) CF hold time to guarantee design revision selection is sampled when VCCO = 1.8V(9) CF to data delay when VCCO = 3.3V or 2.5V(8) CF to data delay when VCCO = OE/RESET to data delay (6) 1.8V(8) when VCCO = 3.3V or 2.5V XCF01S, XCF02S, XCF04S Min 300 300 - - - - - - - - 0 0 - - - - 10 30 15 30 15 30 - - 25 30 XCF08P, XCF16P, XCF32P Min 300 300 - - - - - - - - 5 5 - - 25 25 25 25 25 25 25 25 - - 45 45 Units Max Max ns ns ns ns ns ns ns ns ns ns ns ns ns ns THCF TCF TOE TCE TCAC OE/RESET to data delay (6) when VCCO = 1.8V CE to data delay (5) when VCCO = 3.3V or 2.5V CE to data delay (5) when VCCO = 1.8V CLK to data CLK to data delay (7) delay (7) when VCCO = 3.3V or 2.5V when VCCO = 1.8V TOH Data hold from CE, OE/RESET, CLK, or CF when VCCO = 3.3V or 2.5V(8) Data hold from CE, OE/RESET, CLK, or CF when VCCO = 1.8V(8) CE or OE/RESET to data float delay (2) when VCCO = 3.3V or 2.5V CE or OE/RESET to data float delay (2) when VCCO = 1.8V TDF DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 29 R Platform Flash In-System Programmable Configuration PROMs Symbol Description Clock period (6) (serial mode) when VCCO = 3.3V or 2.5V XCF01S, XCF02S, XCF04S Min 30 67 - - 10 15 10 15 counting) (3) 20 30 250 250 250 250 - - - - - - - - - - - - - - - - - - - - - - - - - - - - XCF08P, XCF16P, XCF32P Min 25 25 30 30 12 12 12 12 30 30 2000 2000 2000 2000 12 12 8 8 300 300 300 300 300 300 300 300 Units ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Max - - - - - - - - - Max - - - - - - - - - - - - - - - - - - - - - - - - - - TCYC Clock period (6) (serial mode) when VCCO = 1.8V Clock period (6) (parallel mode) when VCCO = 3.3V or 2.5V Clock period (6) (parallel mode) when VCCO = 1.8V CLK Low time(3) when VCCO = 3.3V or 2.5V CLK Low CLK High time(3) when VCCO = 1.8V when VCCO = 1.8V CLK High time(3) when VCCO = 3.3V or 2.5V time (3) CE setup time to CLK (guarantees proper when VCCO = 3.3V or 2.5V TLC THC TSCE CE setup time to CLK (guarantees proper counting) (3) when VCCO = 1.8V CE hold time (guarantees counters are reset)(5) when VCCO = 3.3V or 2.5V CE hold time (guarantees counters are reset)(5) when VCCO = 1.8V OE/RESET hold time (guarantees counters are reset)(6) when VCCO = 3.3V or 2.5V OE/RESET hold time (guarantees counters are reset)(6) when VCCO = 1.8V BUSY setup time to CLK when VCCO = 3.3V or 2.5V(8) BUSY setup time to CLK when VCCO = 1.8V(8) 2.5V(8) BUSY hold time to CLK when VCCO = 3.3V or BUSY hold time to CLK when VCCO = 1.8V(8) EN_EXT_SEL setup time to CF, CE or OE/RESET when VCCO = 3.3V or 2.5V(8) EN_EXT_SEL setup time to CF, CE or OE/RESET when VCCO = 1.8V(8) EN_EXT_SEL hold time from CF, CE or OE/RESET when VCCO = 3.3V or 2.5V(8) EN_EXT_SEL hold time from CF, CE or OE/RESET when VCCO = 1.8V(8) REV_SEL setup time to CF, CE or OE/RESET when VCCO = 3.3V or 2.5V(8) REV_SEL setup time to CF, CE or OE/RESET when VCCO = 1.8V(8) REV_SEL hold time from CF, CE or OE/RESET when VCCO = 3.3V or 2.5V(8) REV_SEL hold time from CF, CE or OE/RESET when VCCO = 1.8V(8) THCE THOE TSB THB TSXT THXT TSRV THRV Notes: 1. 2. 3. 4. 5. 6. 7. 8. 9. AC test load = 50 pF for XCF01S/XCF02S/XCF04S; 30 pF for XCF08P/XCF16P/XCF32P. Float delays are measured with 5 pF AC loads. Transition is measured at 200 mV from steady-state active levels. All AC parameters are measured with VIL = 0.0V and VIH = 3.0V. If THCE High < 2 s, TCE = 2 s. If THOE Low < 2 s, TOE = 2 s. This is the minimum possible TCYC. Actual TCYC = TCAC + FPGA Data setup time. Example: With the XCF32P in serial mode with VCCO at 3.3V, if FPGA data setup time = 15 ns, then the actual TCYC = 25 ns +15 ns = 40 ns. Guaranteed by design; not tested. CF, EN_EXT_SEL, REV_SEL[1:0], and BUSY are inputs for the XCFxxP PROM only. When JTAG CONFIG command is issued, PROM drives CF Low for at least the THCF minimum. DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 30 R Platform Flash In-System Programmable Configuration PROMs XCFxxP PROM as Configuration Master with CLK Input Pin as Clock Source X-Ref Target - Figure 16 CE THCE THOE TCYCO TLC THC OE/RESET CLK TCLKO CLKOUT TCECC TOECC TSB THB T CCDD TCOH TDDC TOE TCE TCECF TOECF BUSY (optional) DATA TCF TCFCC THCF TEOH TDF CF EN_EXT_SEL TSXT THXT TSXT THXT REV_SEL[1:0] TSRV THRV TSRV THRV Note:Typically, 8 CLKOUT cycles are output after CE rising edge, before CLKOUT tristates, if OE/RESET remains high, and terminal count has not been reached. ds123_25_110707 Symbol Description CF hold time to guarantee design revision selection is sampled when VCCO = 3.3V or 2.5V(11) CF hold time to guarantee design revision selection is sampled when VCCO = 1.8V(11) CF to data delay when VCCO = 3.3V or 2.5V CF to data delay when VCCO = 1.8V OE/RESET to data OE/RESET to data CE to data CE to data delay (5) delay (5) delay (6) delay (6) when VCCO = 3.3V or 2.5V when VCCO = 1.8V XCF08P, XCF16P, XCF32P Min 300 300 - - - - - - 5 5 - - - - - - 25 25 25 25 - - 45 45 Units Max 300 300 ns ns ns ns ns ns ns ns ns ns ns ns ns ns THCF TCF TOE TCE TEOH TDF TOECF TCECF when VCCO = 3.3V or 2.5V when VCCO = 1.8V Data hold from CE, OE/RESET, or CF when VCCO = 3.3V or 2.5V Data hold from CE, OE/RESET, or CF when VCCO = 1.8V CE or OE/RESET to data float CE or OE/RESET to data float OE/RESET to CLKOUT float OE/RESET to CLKOUT float CE to CLKOUT float CE to CLKOUT float delay(2) delay(2) delay (2) delay (2) when VCCO = 3.3V or 2.5V when VCCO = 1.8V delay(2) delay(2) when VCCO = 3.3V or 2.5V when VCCO = 1.8V when VCCO = 3.3V or 2.5V when VCCO = 1.8V DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 31 R Platform Flash In-System Programmable Configuration PROMs Symbol Clock TCYCO Clock Clock Clock TLC THC THCE THOE TSB THB period (7) period (7) period (7) period (7) Description (serial mode) when VCCO = 3.3V or 2.5V (serial mode) when VCCO = 1.8V (parallel mode) when VCCO = 3.3V or 2.5V (parallel mode) when VCCO = 1.8V when VCCO = 3.3V or 2.5V when VCCO = 1.8V when VCCO = 3.3V or 2.5V when VCCO = 1.8V reset)(5) reset)(5) when VCCO = 3.3V or 2.5V when VCCO = 1.8V reset)(6) reset)(6) when VCCO = 3.3V or 2.5V when VCCO = 1.8V XCF08P, XCF16P, XCF32P Min 30 30 35 35 12 12 12 12 2000 2000 2000 2000 12 12 8 8 - - - - 0 0 0 0 0 0 Units ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns - - - - - - Max - - - - - - - - - - - - - - - - 35 35 35 35 2 CLK cycles 2 CLK cycles 2 CLK cycles 2 CLK cycles CLK Low CLK Low CLK High CLK High time(3) time(3) time(3) time(3) CE hold time (guarantees counters are CE hold time (guarantees counters are OE/RESET hold time (guarantees counters are OE/RESET hold time (guarantees counters are BUSY setup time to CLKOUT when VCCO = 3.3V or 2.5V BUSY setup time to CLKOUT when VCCO = 1.8V BUSY hold time to CLKOUT when VCCO = 3.3V or 2.5V BUSY hold time to CLKOUT when VCCO = 1.8V CLK input to CLKOUT output delay when VCCO = 3.3V or 2.5V CLK input to CLKOUT output delay when VCCO = 1.8V CLK input to CLKOUT output delay when VCCO = 3.3V or 2.5V with decompression (12) CLK input to CLKOUT output delay when VCCO = 1.8V with decompression (12) CE to CLKOUT delay(8) when VCCO = 3.3V or 2.5V TCLKO TCECC CE to CLKOUT delay (8) when VCCO = 1.8V OE/RESET to CLKOUT delay(8) when VCCO = 3.3V or 2.5V TOECC OE/RESET to CLKOUT delay(8) when VCCO = 1.8V TCFCC TCCDD TDDC CF to CLKOUT delay(8) when VCCO = 3.3V or 2.5V CF to CLKOUT delay(8) when VCCO = 1.8V 2.5V(9) decompression (9)(12) 1.8V(9) decompression (9)(12) CLKOUT to data delay when VCCO = 3.3V or CLKOUT to data delay when VCCO = - - 5 5 3 3 decompression (12) 3 3 300 300 30 30 ns ns ns ns Data setup time to CLKOUT when VCCO = 3.3V or 2.5V with Data setup time to CLKOUT when VCCO = 1.8V with Data hold from CLKOUT when VCCO = 3.3V or 2.5V Data hold from CLKOUT when VCCO = 1.8V Data hold from CLKOUT when VCCO = 3.3V or 2.5V with Data hold from CLKOUT when VCCO = 1.8V with - - - - - - ns ns ns ns ns ns TCOH decompression (12) TSXT EN_EXT_SEL setup time to CF, CE, or OE/RESET when VCCO = 3.3V or 2.5V EN_EXT_SEL setup time to CF, CE, or OE/RESET when VCCO = 1.8V DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 32 R Platform Flash In-System Programmable Configuration PROMs Symbol Description EN_EXT_SEL hold time from CF, CE, or OE/RESET when VCCO = 3.3V or 2.5V EN_EXT_SEL hold time from CF, CE, or OE/RESET when VCCO = 1.8V REV_SEL setup time to CF, CE, or OE/RESET when VCCO = 3.3V or 2.5V REV_SEL setup time to CF, CE, or OE/RESET when VCCO = 1.8V REV_SEL hold time from CF, CE, or OE/RESET when VCCO = 3.3V or 2.5V REV_SEL hold time from CF, CE, or OE/RESET when VCCO = 1.8V XCF08P, XCF16P, XCF32P Min Max - - - - - - Units ns ns ns ns ns ns THXT TSRV THRV Notes: 1. 2. 3. 4. 5. 6. 7. 300 300 300 300 300 300 AC test load = 50 pF for XCF01S/XCF02S/XCF04S; 30 pF for XCF08P/XCF16P/XCF32P. Float delays are measured with 5 pF AC loads.Transition is measured at 200 mV from steady-state active levels. Guaranteed by design, not tested. All AC parameters are measured with VIL = 0.0V and VIH = 3.0V. If THCE High < 2 s, TCE = 2 s. If THOE Low < 2 s, TOE = 2 s. This is the minimum possible TCYCO. Actual TCYCO = TCCDD + FPGA Data setup time. Example: With the XCF32P in serial mode with VCCO at 3.3V, if FPGA Data setup time = 15 ns, then the actual TCYCO = 25 ns +15 ns = 40 ns. 8. The delay before the enabled CLKOUT signal begins clocking data out of the device is dependent on the clocking configuration. The delay before CLKOUT is enabled increases if decompression is enabled. 9. Slower CLK frequency option might be required to meet the FPGA data sheet setup time. 10. When decompression is enabled, the CLKOUT signal becomes a controlled clock output. When decompressed data is available, CLKOUT toggles at 1/2 the source clock frequency (either 1/2 the selected internal clock frequency or 1/2 the external CLK input frequency). When decompressed data is not available, the CLKOUT pin is parked High. If CLKOUT is used, then it must be pulled High externally using a 4.7 k pull-up to VCCO. 11. When JTAG CONFIG command is issued, PROM drives CF Low for at least the THCF minimum. DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 33 R Platform Flash In-System Programmable Configuration PROMs XCFxxP PROM as Configuration Master with Internal Oscillator as Clock Source X-Ref Target - Figure 17 CE THCE THOE OE/RESET CLKOUT TCEC TOEC TSB THB TCDD TCOH TDDC TOE TCE TCECF TOECF BUSY (optional) DATA TCF TCFC THCF TEOH TDF CF EN_EXT_SEL TSXT THXT TSXT THXT REV_SEL[1:0] TSRV THRV TSRV THRV Note: Typically, 8 CLKOUT cycles are output after CE rising edge, before CLKOUT tristates, if OE/RESET remains high, and terminal count has not been reached. ds123_26_110707 Symbol Description CF hold time to guarantee design revision selection is sampled when VCCO = 3.3V or 2.5V(12) CF hold time to guarantee design revision selection is sampled when VCCO = 1.8V(12) CF to data delay when VCCO = 3.3V or 2.5V CF to data delay when VCCO = 1.8V OE/RESET to data delay(6) when VCCO = 3.3V or 2.5V OE/RESET to data delay(6) when VCCO = 1.8V CE to data delay(5) when VCCO = 3.3V or 2.5V CE to data delay(5) when VCCO = 1.8V Data hold from CE, OE/RESET, or CF when VCCO = 3.3V or 2.5V Data hold from CE, OE/RESET, or CF when VCCO = 1.8V CE or OE/RESET to data float delay (2) when VCCO = 3.3V or 2.5V CE or OE/RESET to data float OE/RESET to CLKOUT float CE to CLKOUT float CE to CLKOUT float delay(2) delay(2) delay (2) when VCCO = 1.8V delay(2) when VCCO = 3.3V or 2.5V XCF08P, XCF16P, XCF32P Min 300 300 - - - - - - 5 5 - - - - - - 2000 2000 2000 2000 - - - - 25 25 25 25 - - 45 45 Units Max 300 300 ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns THCF TCF TOE TCE TEOH TDF TOECF TCECF THCE THOE OE/RESET to CLKOUT float delay(2) when VCCO = 1.8V when VCCO = 3.3V or 2.5V when VCCO = 1.8V reset) (5) when VCCO = 1.8V reset) (6) reset) (6) when VCCO = 3.3V or 2.5V when VCCO = 1.8V CE hold time (guarantees counters are reset) (5) when VCCO = 3.3V or 2.5V CE hold time (guarantees counters are OE/RESET hold time (guarantees counters are OE/RESET hold time (guarantees counters are DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 34 R Platform Flash In-System Programmable Configuration PROMs Symbol Description BUSY setup time to CLKOUT when VCCO = 3.3V or 2.5V BUSY setup time to CLKOUT when VCCO = 1.8V BUSY hold time to CLKOUT when VCCO = 3.3V or 2.5V BUSY hold time to CLKOUT when VCCO = 1.8V CE to CLKOUT delay(7) when VCCO = 3.3V or 2.5V CE to CLKOUT delay (7) when VCCO = 1.8V OE/RESET to CLKOUT delay(7) when VCCO = 3.3V or 2.5V OE/RESET to CLKOUT CF to CLKOUT delay(7) when VCCO = 1.8V CF to CLKOUT delay(7) when VCCO = 3.3V or 2.5V delay(7) when VCCO = 1.8V 2.5V(8) 1.8V(8) CLKOUT to data delay when VCCO = 3.3V or CLKOUT to data delay when VCCO = XCF08P, XCF16P, XCF32P Min Max - - - - 1 1 1 1 12 12 8 8 0 0 0 0 0 0 - - 5 5 3 3 decompression(11) 3 3 300 300 300 300 300 300 300 300 25 12.5 12.5 6 - - - - - - - - - - - - 50 25 25 12.5 30 30 Units ns ns ns ns s s s s - - ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns MHz MHz MHz MHz TSB THB TCEC TOEC TCFC TCDD TDDC Data setup time to CLKOUT when VCCO = 3.3V or 2.5V with decompression (8)(11) Data setup time to CLKOUT when VCCO = 1.8V with decompression(8)(11) Data hold from CLKOUT when VCCO = 3.3V or 2.5V Data hold from CLKOUT when VCCO = 1.8V Data hold from CLKOUT when VCCO = 3.3V or 2.5V with Data hold from CLKOUT when VCCO = 1.8V with decompression(11) TCOH TSXT THXT TSRV THRV FF FS Notes: EN_EXT_SEL setup time to CF, CE, or OE/RESET when VCCO = 3.3V or 2.5V EN_EXT_SEL setup time to CF, CE, or OE/RESET when VCCO = 1.8V EN_EXT_SEL hold time from CF, CE, or OE/RESET when VCCO = 3.3V or 2.5V EN_EXT_SEL hold time from CF, CE, or OE/RESET when VCCO = 1.8V REV_SEL setup time to CF, CE, or OE/RESET when VCCO = 3.3V or 2.5V REV_SEL setup time to CF, CE, or OE/RESET when VCCO = 1.8V REV_SEL hold time from CF, CE, or OE/RESET when VCCO = 3.3V or 2.5V REV_SEL hold time from CF, CE, or OE/RESET when VCCO = 1.8V CLKOUT default (fast) frequency(9) frequency(10) decompression(11) CLKOUT default (fast) frequency with decompression(11) CLKOUT alternate (slower) CLKOUT alternate (slower) frequency with AC test load = 50 pF for XCF01S/XCF02S/XCF04S; 30 pF for XCF08P/XCF16P/XCF32P. Float delays are measured with 5 pF AC loads. Transition is measured at 200 mV from steady-state active levels. Guaranteed by design, not tested. All AC parameters are measured with VIL = 0.0V and VIH = 3.0V. If THCE High < 2 s, TCE = 2 s. If THOE Low < 2 s, TOE = 2 s. The delay before the enabled CLKOUT signal begins clocking data out of the device is dependent on the clocking configuration. The delay before CLKOUT is enabled increases if decompression is enabled. 8. Slower CLK frequency option might be required to meet the FPGA data sheet setup time. 9. Typical CLKOUT default (fast) period = 25 ns (40 MHz). 10. Typical CLKOUT alternate (slower) period = 50 ns (20 MHz). 11. When decompression is enabled, the CLKOUT signal becomes a controlled clock output. When decompressed data is available, CLKOUT toggles at 1/2 the source clock frequency (either 1/2 the selected internal clock frequency or 1/2 the external CLK input frequency). When decompressed data is not available, the CLKOUT pin is parked High. If CLKOUT is used, then it must be pulled High externally using a 4.7 k pull-up to VCCO. 12. When JTAG CONFIG command is issued, PROM drives CF Low for at least the THCF minimum. 1. 2. 3. 4. 5. 6. 7. DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 35 R Platform Flash In-System Programmable Configuration PROMs AC Characteristics Over Operating Conditions When Cascading X-Ref Target - Figure 18 OE/RESET CE CLK CLKOUT (optional) DATA Last Bit TCDF TCODF TOCE TOOE First Bit TOCK TCOCE CEO ds123_23_102203 Symbol Description CLK to output float delay (2,3) when VCCO = 2.5V or 3.3V CLK to output float delay (2,3) when VCCO = 1.8V CLK to CEO delay (3,5) when VCCO = 2.5V or 3.3V CLK to CEO delay (3,5) when VCCO = 1.8V CE to CEO delay (3,6) when VCCO = 2.5V or 3.3V CE to CEO delay (3,6) when VCCO = 1.8V OE/RESET to CEO delay (3) when VCCO = 2.5V or 3.3V OE/RESET to CEO delay (3) when VCCO = 1.8V CLKOUT to CEO delay when VCCO = 2.5V or 3.3V CLKOUT to CEO delay when VCCO = 1.8V CLKOUT to output float delay when VCCO = 2.5V or 3.3V CLKOUT to output float delay when VCCO = 1.8V XCF01S, XCF02S, XCF04S Min Max 25 35 20 35 20 35 20 35 - - - - XCF08P, XCF16P, XCF32P Min - - - - - - - - - - - - Units Max 20 20 20 20 80 80 80 80 20 20 25 25 ns ns ns ns ns ns ns ns ns ns ns ns TCDF - - - - - - - - - - - - TOCK TOCE TOOE TCOCE TCODF Notes: 1. AC test load = 50 pF for XCF01S/XCF02S/XCF04S; 30 pF for XCF08P/XCF16P/XCF32P. 2. Float delays are measured with 5 pF AC loads. Transition is measured at 200 mV from steady state active levels. 3. Guaranteed by design, not tested. 4. All AC parameters are measured with VIL = 0.0V and VIH = 3.0V. 5. For cascaded PROMs, if the FPGA's dual-purpose configuration data pins are set to persist as configuration pins, the minimum period is increased based on the CLK to CEO and CE to data propagation delays: - TCYC minimum = TOCK + TCE + FPGA Data setup time - TCAC maximum = TOCK + TCE 6. For cascaded PROMs, if the FPGA's dual-purpose configuration data pins become general I/O pins after configuration; to allow for the disable to propagate to the cascaded PROMs and to avoid contention on the data lines following configuration, the minimum period is increased based on the CE to CEO and CE to data propagation delays: - TCYC minimum = TOCE + TCE - TCAC maximum = TOCK + TCE DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 36 R Platform Flash In-System Programmable Configuration PROMs Pinouts and Pin Descriptions The XCFxxS Platform Flash PROM is available in the VO20 and VOG20 packages. The XCFxxP Platform Flash PROM is available in the VO48, VOG48, FS48, and FSG48 packages. For package drawings, specifications, and additional information, see Device Package User Guide, or the Xilinx Package Specifications. Notes: 1. VO20/VOG20 denotes a 20-pin (TSSOP) Plastic Thin Shrink Small Outline Package. 2. VO48/VOG48 denotes a 48-pin (TSOP) Plastic Thin Small Outline Package. 3. FS48/FSG48 denotes a 48-pin (TFBGA) Plastic Thin Fine Pitch Ball Grid Array (0.8 mm pitch). XCFxxS Pinouts and Pin Descriptions XCFxxS VO20/VOG20 Pin Names and Descriptions Table 13 provides a list of the pin names and descriptions for the XCFxxS 20-pin VO20/VOG20 package. Table 13: XCFxxS Pin Names and Descriptions Pin Name D0 Boundary Scan Order 4 3 0 20 Boundary-Scan Function Data Out Output Enable Data In Data In Data Out Output Enable Data In Data Out Output Enable Data Out Pin Description D0 is the DATA output pin to provide data for configuring an FPGA in serial mode. The D0 output is set to a highimpedance state during ISPEN (when not clamped). Configuration Clock Input. Each rising edge on the CLK input increments the internal address counter if the CLK input is selected, CE is Low, and OE/RESET is High. Output Enable/Reset (Open-Drain I/O). When Low, this input holds the address counter reset and the DATA output is in a high-impedance state. This is a bidirectional open-drain pin that is held Low while the PROM completes the internal power-on reset sequence. Polarity is not programmable. Chip Enable Input. When CE is High, the device is put into low-power standby mode, the address counter is reset, and the DATA pins are put in a high-impedance state. Configuration Pulse (Open-Drain Output). Allows JTAG CONFIG instruction to initiate FPGA configuration without powering down FPGA. This is an open-drain output that is pulsed Low by the JTAG CONFIG command. Chip Enable Output. Chip Enable Output (CEO) is connected to the CE input of the next PROM in the chain. This output is Low when CE is Low and OE/RESET input is High, AND the internal address counter has been incremented beyond its Terminal Count (TC) value. CEO returns to High when OE/RESET goes Low or CE goes High. JTAG Mode Select Input. The state of TMS on the rising edge of TCK determines the state transitions at the Test Access Port (TAP) controller. TMS has an internal 50 K resistive pull-up to VCCJ to provide a logic 1 to the device if the pin is not driven. JTAG Clock Input. This pin is the JTAG test clock. It sequences the TAP controller and all the JTAG test and programming electronics. JTAG Serial Data Input. This pin is the serial input to all JTAG instruction and data registers. TDI has an internal 50 K resistive pull-up to VCCJ to provide a logic 1 to the device if the pin is not driven. 20-pin TSSOP (VO20/VOG20) 1 CLK 3 OE/RESET 19 18 8 CE 15 22 10 CF 21 12 7 CEO 11 Output Enable 13 TMS - Mode Select 5 TCK - Clock 6 TDI - Data In 4 DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 37 R Platform Flash In-System Programmable Configuration PROMs Table 13: XCFxxS Pin Names and Descriptions (Cont'd) Pin Name Boundary Scan Order - Boundary-Scan Function Data Out Pin Description JTAG Serial Data Output. This pin is the serial output for all JTAG instruction and data registers. TDO has an internal 50 K resistive pull-up to VCCJ to provide a logic 1 to the system if the pin is not driven. +3.3V Supply. Positive 3.3V supply voltage for internal logic. +3.3V, 2.5V, or 1.8V I/O Supply. Positive 3.3V, 2.5V, or 1.8V supply voltage connected to the output voltage drivers and input buffers. +3.3V or 2.5V JTAG I/O Supply. Positive 3.3V or 2.5V supply voltage connected to the TDO output voltage driver and TCK, TMS, and TDI input buffers. Ground Do not connect. (These pins must be left unconnected.) 20-pin TSSOP (VO20/VOG20) 17 TDO VCCINT VCCO - - - - 18 19 VCCJ GND DNC - - - - - - 20 11 2, 9, 12, 14, 15, 16 XCFxxS VO20/VOG20 Pinout Diagram X-Ref Target - Figure 19 D0 (DNC) CLK TDI TMS TCK CF OE/RESET (DNC) CE 1 2 3 4 5 6 7 8 9 10 20 19 18 17 15 14 13 12 11 VCCJ VCCO VCCINT TDO (DNC) (DNC) (DNC) CEO (DNC) GND ds123_02_071304 VO20/VOG20 16 Top View Figure 19: VO20/VOG20 Pinout Diagram (Top View) with Pin Names DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 38 R Platform Flash In-System Programmable Configuration PROMs XCFxxP Pinouts and Pin Descriptions XCFxxP VO48/VOG48 and FS48/FSG48 Pin Names and Descriptions Table 14 provides a list of the pin names and descriptions for the XCFxxP 48-pin VO48/VOG48 and 48-pin FS48/FSG48 packages. Table 14: XCFxxP Pin Names and Descriptions (VO48/VOG48 and FS48/FSG48) Pin Name BoundaryScan Order 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 BoundaryScan Function Data Out Output Enable Data Out Output Enable Pin Description 48-pin TSOP (VO48/ VOG48) 28 48-pin TFBGA (FS48/ FSG48) H6 D0 D1 29 H5 D2 D3 D4 D5 D0 is the DATA output pin to provide data for configuring an Output Enable FPGA in serial mode. D0-D7 are the DATA output pins to provide parallel data for Data Out configuring a Xilinx FPGA in SelectMap (parallel) mode. Output Enable The D0 output is set to a high-impedance state during ISPEN (when not clamped). Data Out The D1-D7 outputs are set to a high-impedance state during Output Enable ISPEN (when not clamped) and when serial mode is selected for configuration. The D1-D7 pins can be left unconnected Data Out when the PROM is used in serial mode. Output Enable Data Out Output Enable Data Out Output Enable Configuration Clock Input. An internal programmable control bit selects between the internal oscillator and the CLK input pin as the clock source to control the configuration sequence. Each rising edge on the CLK input increments the internal address counter if the CLK input is selected, CE is Low, OE/RESET is High, BUSY is Low (parallel mode only), and CF is High. Data Out 32 E5 33 D5 43 C5 44 B5 D6 47 A5 D7 48 A6 CLK 01 Data In 12 B3 04 03 OE/RESET 02 00 CE Output Enable/Reset (Open-Drain I/O). When Low, this input holds the address counter reset and the Data Out DATA and CLKOUT outputs are placed in a high-impedance state. This is a bidirectional open-drain pin that is held Low Output Enable while the PROM completes the internal power-on reset sequence. Polarity is not programmable. Data In Chip Enable Input. When CE is High, the device is put into low-power standby mode, the address counter is reset, and the DATA and CLKOUT outputs are placed in a highimpedance state. Data In 11 A3 13 B4 11 10 CF 09 Configuration Pulse (Open-Drain I/O). As an output, this pin allows the JTAG CONFIG instruction to initiate FPGA configuration without powering down the FPGA. This is an open-drain signal that is pulsed Low by the JTAG CONFIG Data Out command. As an input, on the rising edge of CF, the current design revision selection is sampled and the internal address counter is reset to the start address for the selected revision. Output Enable If unused, the CF pin must be pulled High using an external 4.7 K pull-up to VCCO. Data In 6 D1 DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 39 R Platform Flash In-System Programmable Configuration PROMs Table 14: XCFxxP Pin Names and Descriptions (VO48/VOG48 and FS48/FSG48) (Cont'd) Pin Name BoundaryScan Order 06 CEO BoundaryScan Function Data Out Pin Description 48-pin TSOP (VO48/ VOG48) 48-pin TFBGA (FS48/ FSG48) 05 Chip Enable Output. Chip Enable Output (CEO) is connected to the CE input of the next PROM in the chain. This output is Low when CE is Low and OE/RESET input is High, AND the internal address counter has been incremented beyond its Output Enable Terminal Count (TC) value or the PROM does not contain any blocks that correspond to the selected revision. CEO returns to High when OE/RESET goes Low or CE goes High. Enable External Selection Input. When this pin is Low, design revision selection is controlled by the Revision Select pins. When this pin is High, design revision selection is controlled by the internal programmable Revision Select control bits. EN_EXT_SEL has an internal 50 K resistive pull-up to VCCO to provide a logic 1 to the device if the pin is not driven. Revision Select[1:0] Inputs. When the EN_EXT_SEL is Low, the Revision Select pins are used to select the design revision to be enabled, overriding the internal programmable Revision Select control bits. The Revision Select[1:0] inputs have an internal 50 K resistive pull-up to VCCO to provide a logic 1 to the device if the pins are not driven. Busy Input. The BUSY input is enabled when parallel mode is selected for configuration. When BUSY is High, the internal address counter stops incrementing and the current data remains on the data pins. On the first rising edge of CLK after BUSY transitions from High to Low, the data for the next address is driven on the data pins. When serial mode or decompression is enabled during device programming, the BUSY input is disabled. BUSY has an internal 50 K resistive pull-down to GND to provide a logic 0 to the device if the pin is not driven. 10 D2 EN_EXT_SEL 31 Data In 25 H4 REV_SEL0 30 Data In 26 G3 REV_SEL1 29 Data In 27 G4 BUSY 12 Data In 5 C1 08 CLKOUT 07 Configuration Clock Output. An internal Programmable control bit enables the CLKOUT signal, which is sourced from either the internal oscillator or the CLK input pin. Each rising edge of the selected clock source increments the internal address counter if data is available, CE is Low, and OE/RESET is High. Output data is available on the rising Output Enable edge of CLKOUT. CLKOUT is disabled if CE is High or OE/RESET is Low. If decompression is enabled, CLKOUT is parked High when decompressed data is not ready. When CLKOUT is disabled, the CLKOUT pin is put into a high-Z state. If CLKOUT is used, then it must be pulled High externally using a 4.7 K pull-up to VCCO. Mode Select JTAG Mode Select Input. The state of TMS on the rising edge of TCK determines the state transitions at the Test Access Port (TAP) controller. TMS has an internal 50 K resistive pull-up to VCCJ to provide a logic 1 to the device if the pin is not driven. JTAG Clock Input. This pin is the JTAG test clock. It sequences the TAP controller and all the JTAG test and programming electronics. JTAG Serial Data Input. This pin is the serial input to all JTAG instruction and data registers. TDI has an internal 50 K resistive pull-up to VCCJ to provide a logic 1 to the device if the pin is not driven. JTAG Serial Data Output. This pin is the serial output for all JTAG instruction and data registers. TDO has an internal 50K resistive pull-up to VCCJ to provide a logic 1 to the system if the pin is not driven. Data Out 9 C2 TMS - 21 E2 TCK - Clock 20 H3 TDI - Data In 19 G1 TDO - Data Out 22 E6 DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 40 R Platform Flash In-System Programmable Configuration PROMs Table 14: XCFxxP Pin Names and Descriptions (VO48/VOG48 and FS48/FSG48) (Cont'd) Pin Name BoundaryScan Order - BoundaryScan Function - Pin Description 48-pin TSOP (VO48/ VOG48) 4, 15, 34 8, 30, 38, 45 48-pin TFBGA (FS48/ FSG48) B1, E1, G6 B2, C6, D6, G5 VCCINT +1.8V Supply. Positive 1.8V supply voltage for internal logic. +3.3V, 2.5V, 1.8V, or 1.5V I/O Supply. Positive 3.3V, 2.5V, 1.8V, or 1.5V supply voltage connected to the output voltage drivers and input buffers. +3.3V or 2.5V JTAG I/O Supply. Positive 3.3V or 2.5V supply voltage connected to the TDO output voltage driver and TCK, TMS, and TDI input buffers. Ground VCCO - - VCCJ - - 24 H2 GND - - A1, A2, 2, 7, B6, F1, 17, 23, 31, 36, 46 F5, F6, H1 1, 3, 14, 16, 18, 35, 37, 39, 40, 41, 42 A4, C3, C4, D3, D4, E3, E4, F2, F3, F4, G2 DNC - - Do Not Connect. (These pins must be left unconnected.) XCFxxP VO48/VOG48 Pinout Diagram X-Ref Target - Figure 20 DNC GND DNC VCCINT BUSY CF GND VCCO CLKOUT CEO OE/RESET CLK CE DNC VCCINT DNC GND DNC TDI TCK TMS TDO GND VCCJ 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 VO48/VOG48 Top View 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 D7 D6 GND VCCO D5 D4 DNC DNC DNC DNC VCCO DNC GND DNC VCCINT D3 D2 GND VCCO D1 D0 REV_SEL1 REV_SEL0 EN_EXT_SEL DS123_24_031908 Figure 20: VO48/VOG48 Pinout Diagram (Top View) with Pin Names DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 41 R Platform Flash In-System Programmable Configuration PROMs XCFxxP FS48/FSG48 Pin Names Table 15: XCFxxP Pin Names (FS48/FSG48) Pin Number A1 A2 A3 A4 A5 A6 B1 B2 B3 B4 B5 B6 C1 C2 C3 C4 C5 C6 D1 D2 D3 D4 D5 D6 XCFxxP FS48/FSG48 Pinout Diagram X-Ref Target - Figure 21 Pin Name GND GND OE/RESET DNC D6 D7 VCCINT VCCO CLK CE D5 GND BUSY CLKOUT DNC DNC D4 VCCO CF CEO DNC DNC D3 VCCO Pin Number E1 E2 E3 E4 E5 E6 F1 F2 F3 F4 F5 F6 G1 G2 G3 G4 G5 G6 H1 H2 H3 H4 H5 H6 Pin Name VCCINT TMS DNC DNC D2 TDO GND DNC DNC DNC GND GND TDI DNC REV_SEL0 REV_SEL1 VCCO VCCINT GND VCCJ TCK EN_EXT_SEL D1 D0 FS48/FSG48 Top View 1 2 3 4 5 6 A B C D E F G H ds121_01_071604 Figure 21: FS48/FSG48 Pinout Diagram (Top View) DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 42 R Platform Flash In-System Programmable Configuration PROMs Ordering Information XCF04S VO20 C Device Number XCF01S XCF02S XCF04S Operating Range/Processing C = Industrial (TA = -40C to +85C) Package Type VO20 = 20-pin TSSOP Package VOG20 = 20-pin TSSOP Package, Pb-free DS123_27_112407 XCF32P FS48 C Device Number XCF08P XCF16P XCF32P Operating Range/Processing C = Industrial (TA = -40C to +85C) Package Type VO48 = 48-pin TSOP Package VOG48 = 48-pin TSOP Package, Pb-free FS48 = 48-pin TFBGA Package FSG48 = 48-pin TFBGA Package, Pb-free DS123_28_112407 Valid Ordering Combinations XCF01SVO20 C XCF02SVO20 C XCF04SVO20 C XCF08PVO48 C XCF16PVO48 C XCF32PVO48 C XCF08PFS48 C XCF16PFS48 C XCF32PFS48 C XCF01SVOG20 C XCF02SVOG20 C XCF04SVOG20 C XCF08PVOG48 C XCF16PVOG48 C XCF32PVOG48 C XCF08PFSG48 C XCF16PFSG48 C XCF32PFSG48 C Marking Information XCF04S V Device Number XCF01S XCF02S XCF04S XCF08P XCF16P XCF32P Operating Range/Processing [No Mark] = Industrial (TA = -40C to +85C) Package Type V = 20-pin TSSOP Package (VO20) VG = 20-pin TSSOP Package, Pb-free (VOG20) VO48 = 48-pin TSOP Package (VO48) VOG48 = 48-pin TSOP Package, Pb-free (VOG48) F48 = 48-pin TFBGA Package (FS48) FG48 = 48-pin TFBGA Package, Pb-free (FSG48) DS123_29_112407 DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 43 R Platform Flash In-System Programmable Configuration PROMs Figure 22 through Figure 24 illustrate the part markings for each available package. Note: Package types can differ from the samples shown. X-Ref Target - Figure 22 Device Number Xilinx Logo XCF04STM VG XX YWW XXX Package Type Date Code (YWW = 200Y workweek #WW) Traceability Code TSSOP Pin 1 Figure 22: 20-Pin TSSOP Marking X-Ref Target - Figure 23 DS123_30_030908 TSOP Pin 1 Xilinx Logo Device Number Fab Code XCF32PTM VOG48 XXX XXXXX XX Country of Origin XXX XX YWW Traceability Code Date Code (YWW= 200Y workweek #WW) DS123_31_031008 Package Type Figure 23: 48-Pin TSOP Marking X-Ref Target - Figure 24 Device Number Xilinx Logo XCF32PTM FG48 Package Type XXX XXXXX XX Country of Origin XXX XX YWW Fab Code Traceability Code Date Code (YWW= 200Y workweek #WW) TFBGA Ball A1 Figure 24: 48-Pin TFBGA Marking DS123_32_031008 DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 44 R Platform Flash In-System Programmable Configuration PROMs Revision History The following table shows the revision history for this document. Date 04/29/03 06/03/03 11/05/03 11/18/03 Version 1.0 1.1 2.0 2.1 Xilinx Initial Release. Made edits to all pages. Major revision. Revision Pinout corrections as follows: * Table 14: For VO48 package, removed 38 from VCCINT and added it to VCCO. For FS48 package, removed pin D6 from VCCINT and added it to VCCO. * Table 15 (FS48 package): For pin D6, changed name from VCCINT to VCCO. For pin A4, changed name from GND to DNC. * Figure 16 (VO48 package): For pin 38, changed name from VCCINT to VCCO. * Added specification (4.7k) for recommended pull-up resistor on OE/RESET pin to section "Reset and Power-On Reset Activation," page 24. * Added paragraph to section "Standby Mode," page 25, concerning use of a pull-up resistor and/or buffer on the DONE pin. * Section "Features," page 1: Added package styles and 33 MHz configuration speed limit to itemized features. * Section "Description," page 1 and following: Added state conditions for CF and BUSY to the descriptive text. * Table 2, page 3: Updated Virtex-II configuration bitstream sizes. * Section "Design Revisioning," page 10: Rewritten. * Section "PROM to FPGA Configuration Mode and Connections Summary," page 12 and following, five instances: Added instruction to tie CF High if it is not tied to the FPGA's PROG_B (PROGRAM) input. * Figure 6, page 16, through Figure 13, page 23: Added footnote indicating the directionality of the CF pin in each configuration. * Section "I/O Input Voltage Tolerance and Power Sequencing," page 24: Rewritten. * Table 12, page 25: Added CF column to truth table, and added an additional row to document the Low state of CF. * Section "Absolute Maximum Ratings," page 26: Revised VIN and VTS for 'P' devices. * Section "Supply Voltage Requirements for Power-On Reset and Power-Down," page 26: Revised footnote callout number on TOER from Footnote (4) to Footnote (3). Added Footnote (2) callout to TVCC. * Section "Recommended Operating Conditions," page 27: Added Typical (Typ) parameter columns and parameters for VCCINT and VCCO/VCCJ. Added 1.5V operation parameter row to VIL and VIH, 'P' devices. Revised VIH Min, 2.5V operation, from 2.0V to 1.7V. Added parameter row TIN and Max parameters * (Continued on next page) * Section "DC Characteristics Over Operating Conditions," page 28: Added parameter row and parameters for parallel configuration mode, 'P' devices, to ICCO . Added Footnote (1) and Footnote (2) with callouts in the Test Conditions column for ICCJ, ICCINTS, ICCOS, and ICCJS, to define active and standby mode requirements. * Section "AC Characteristics Over Operating Conditions," page 29: Corrected description for second TCAC parameter line to show parameters for 1.8V VCCO . Revised Footnote (7) to indicate VCCO = 3.3V. Applied Footnote (7) to second TCYC parameter line. * Section "AC Characteristics Over Operating Conditions When Cascading," page 36: Revised Footnote (5)TCYC Min and TCAC Min formulas. * Table 14, page 39: Added additional state conditions to CLK description. Added function of resetting the internal address counter to CF description. 12/15/03 2.2 05/07/04 2.3 DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 45 R Platform Flash In-System Programmable Configuration PROMs * Added Pb-free package options VOG20, FSG48, and VOG48. * Figure 6, page 16, and Figure 7, page 17: Corrected connection name for FPGA DOUT (OPTIONAL Daisy-chained Slave FPGAs with different configurations) from DOUT to DIN. * Section "Absolute Maximum Ratings," page 26: Removed parameter TSOL from table. (TSOL information can be found in Package User Guide.) * Table 2, page 3: Removed reference to XC2VP125 FPGA. * * * * * Table 1, page 1: Broke out VCCO / VCCJ into two separate columns. Table 9, page 9: Added clarification of ID code die revision bits. Table 10, page 10: Deleted TCKMIN2 (bypass mode) and renamed TCKMIN1 to TCKMIN. Table "Recommended Operating Conditions," page 27: Separated VCCO and VCCJ parameters. Table "DC Characteristics Over Operating Conditions," page 28: Added most parameter values for XCF08P, XCF16P, XCF32P devices. Added Footnote (1) to ICCO specifying no-load conditions. * Table "AC Characteristics Over Operating Conditions," page 29: Added most parameter values for XCF08P, XCF16P, XCF32P devices. Expanded Footnote (1) to include XCF08P, XCF16P, XCF32P devices. Added Footnote (8) through (11) relating to CLKOUT conditions for various parameters. Added rows to TCYC specifying parameters for parallel mode. Added rows specifying parameters with decompression for TCLKO, TCOH, TFF, TSF. Added TDDC (setup time with decompression). * Table "AC Characteristics Over Operating Conditions When Cascading," page 36: Added most parameter values for XCF08P, XCF16P, XCF32P devices. Separated Footnote (5) into Footnotes (5) and (6) to specify different derivations of TCYC, depending on whether dual-purpose configuration pins persist as configuration pins, or become general I/O pins after configuration. 07/20/04 2.4 10/18/04 2.5 03/14/05 2.6 * * * * * * * Added Virtex-4 LX/FX/SX configuration data to Table 2. Corrected Virtex-II configuration data in Table 2. Corrected Virtex-II Pro configuration data in Table 2. Added Spartan-3L configuration data to Table 2. Added Spartan-3E configuration data to Table 2. Paragraph added to FPGA Master SelectMAP (Parallel) Mode (1), Page 13. Changes to DC Characteristics TOER changed, Page 28. IOL changed for VOL, Page 28. VCCO added to test conditions for IIL, IILP, IIHP,and IIH, Page 28. Values modified for IILP and IIHP. * Changes to AC Characteristics TLC and THC modified for 1.8V, Page 32. New rows added for TCEC and TOEC, Page 31. * Minor changes to grammar and punctuation. * Added explanation of "Preliminary" to DC and AC Electrical Characteristics. 07/11/05 2.7 * Move from "Preliminary" to "Product Specification" * Corrections to Virtex-4 configuration bitstream values * Minor changes to Figure 7, page 17, Figure 12, page 22, Figure 13, page 23, and Figure 16, page 31 * Change to "Internal Oscillator," page 10 description * Change to "CLKOUT," page 10 description DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 46 R Platform Flash In-System Programmable Configuration PROMs * Update to the first paragraph of "IEEE 1149.1 Boundary-Scan (JTAG)," page 7. * Added JTAG cautionary note to Page 7. * Corrected logic values for Erase/Program (ER/PROG) Status field, IR[4], listed under "XCFxxP Instruction Register (16 bits wide)," page 7. * Sections "XCFxxS and XCFxxP PROM as Configuration Slave with CLK Input Pin as Clock Source," page 29, "XCFxxP PROM as Configuration Master with CLK Input Pin as Clock Source," page 31 and "XCFxxP PROM as Configuration Master with Internal Oscillator as Clock Source," page 34 added to "AC Characteristics Over Operating Conditions," page 29. * Notes for Figure 6, page 16, Figure 7, page 17, Figure 8, page 18, Figure 9, page 19, Figure 10, page 20, Figure 11, page 21, Figure 12, page 22, and Figure 13, page 23 updated to specify the need for a pull-up resistor if CF is not connected to PROGB. * Enhanced description under section "CLKOUT," page 10. * Enhanced description on design revision sampling under section "Design Revisioning," page 10. * Figure 4 and Figure 5 renamed to Table 7, page 8 and Table 8, page 8 respectively. All tables, figures, and table and figure references renumber this point forward. * Value for "ICCINT," page 28 updated from 5mA to 1mA for XCFxxP. * Block diagram in Figure 2, page 2 updated to show clock source muxing and route clocking to all functional blocks. * Added Virtex-5 LX support to Table 2, page 3. * "VIL" maximum for 2.5V operation in "Recommended Operating Conditions," page 27 updated to match LVCMOS25 standard. * Added Virtex-5 LXT support to Table 2, page 3. * Defined reprogramming operation requirements in "Programming," page 5. * Corrected statements regarding the FPGA BUSY pin and corrected various references. * Removed Spartan-3L support and added Spartan-3A and Virtex-5 SXT support to Table 2, page 3. * Corrected Spartan-3E bitstream sizes in Table 2, page 3. * Correct supported voltages for "VCCJ" in Table 13, page 37, "VCCO" and "VCCJ" in Table 14, page 39. Added Spartan-3A DSP support to Table 2, page 3. * Added support for XC5VLX155, XC5VLX20T, and XC5VLX155T. * Updated JTAG TAP timing specifications in Table 10, page 9 to reflect improved performance. * Tied FPGA CS_B and FPGA RDWR_B to GND in the FPGA SelectMAP schematics (Figure 9, page 19, Figure 10, page 20 Figure 11, page 21, and Figure 13, page 23) to ensure valid logic Low. * Hardwired external oscillator to FPGA CCLK in the FPGA slave mode schematics (Figure 7, page 17, Figure 10, page 20, Figure 12, page 22, and Figure 13, page 23). * Added marking templates (Figure 22, page 44, Figure 23 and Figure 24), and corrected marks for 48-pin TFBGA packages in "Marking Information," page 43. * Other edits and updates made. * Updated document template. * Updated URLs. * Added Virtex-5 FX FPGA support to Table 2, page 3. * Corrected markings for all packaging (Figure 22, page 44, Figure 23, and Figure 24). * Added note regarding variances in packaging and marking to Page 44. * Corrected typo. * Updated trademark notations. 12/29/05 2.8 05/09/06 2.9 12/08/06 2.10 02/01/07 2.11 03/30/07 01/28/08 2.11.1 2.12 03/31/08 2.13 04/03/08 2.13.1 Notice of Disclaimer THE XILINX HARDWARE FPGA AND CPLD DEVICES REFERRED TO HEREIN ("PRODUCTS") ARE SUBJECT TO THE TERMS AND CONDITIONS OF THE XILINX LIMITED WARRANTY WHICH CAN BE VIEWED AT http://www.xilinx.com/warranty.htm. THIS LIMITED WARRANTY DOES NOT EXTEND TO ANY USE OF PRODUCTS IN AN APPLICATION OR ENVIRONMENT THAT IS NOT WITHIN THE SPECIFICATIONS STATED IN THE XILINX DATA SHEET. ALL SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE. PRODUCTS ARE NOT DESIGNED OR INTENDED TO BE FAIL-SAFE OR FOR USE IN ANY APPLICATION REQUIRING FAIL-SAFE PERFORMANCE, SUCH AS LIFE-SUPPORT OR SAFETY DEVICES OR SYSTEMS, OR ANY OTHER APPLICATION THAT INVOKES THE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR PROPERTY OR ENVIRONMENTAL DAMAGE ("CRITICAL APPLICATIONS"). USE OF PRODUCTS IN CRITICAL APPLICATIONS IS AT THE SOLE RISK OF CUSTOMER, SUBJECT TO APPLICABLE LAWS AND REGULATIONS. DS123 (v2.13.1) April 3, 2008 Product Specification www.xilinx.com 47 |
Price & Availability of XCF08PVOG48C
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |